Electronics Forum | Tue Nov 11 17:35:08 EST 2008 | davef
SM-840, is a material qualification document only, with all the test requirements applicable only to a defined test coupon, not to production boards. So, it's useless for what you're trying to accomplish. As assemblers use A-610 - Acceptability Of E
Electronics Forum | Fri Apr 02 02:37:43 EST 2004 | darburch
We are asking $10,500us for this machine, as for shipping I will see what I can come up with as we are in Canada. This is a dual wave machine with foam fluxer. It has not run in 3 years but when we had it in production results were favorable and cons
Electronics Forum | Mon Aug 18 15:03:38 EDT 2008 | awegener
I'd like to get more information about pick and place nozzles. How can I learn more? ... What do the nozzles look like? Are there different shapes? Are custom nozzles sometimes used for custom parts or are the nozzles mostly standardized? What kind
Electronics Forum | Thu Nov 30 16:10:05 EST 2006 | Hussman
Wow, why all the anger? This gap you guys are talking about is measured as "G" in IPC/EIA J-STD-001 (Chunks was there, but she failed to read the fine print). And almost all parts that measure G follow Note 3 which states "Properly wetted fillet s
Electronics Forum | Tue Aug 22 10:06:53 EDT 2000 | George English
Has there been a definite date for the total move over to lead free? Will it be 2004 or 2008. Also is there a direct replacement for leaded solder, I have read various articles on numerous alloys suggested for the switch, such as bismuth, tin, copper
Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq
Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the
Electronics Forum | Tue Nov 11 16:30:08 EST 2008 | naynayno
Occasionally solder mask thickness is believed to be the cause of gasketing challenges during paste printing. We currently specific IPC-SM-840 on our fab drawings but this provides no limits or guidelines on thickness. I do not want to cause an unr
Electronics Forum | Wed May 22 16:36:13 EDT 2002 | slthomas
What methods do you guys use for maintaining lot and/or board traceability? When I worked in med. products, we used travelers that we recorded everything on, then serialized them at the end of the build. Not as effective as up front serialization,
Electronics Forum | Wed Jun 01 13:29:34 EDT 2022 | emeto
It is almost like attempt to advertise something or dig into market opinion for future development of something. In both cases looks like scheme - not clear what they ask for, not clear what they want to achieve.
Electronics Forum | Mon Nov 20 04:04:42 EST 2000 | Gyver
Sirs, Please do me a favor to answer the following questions, thanks a million! 1. Will the baking of BGA or PCB cause more oxidation before the SMT process? 2. What is the acceptable Life Time of solderability at customer site? The time that the sol
