Electronics Forum | Wed Jun 24 18:50:55 EDT 1998 | John Silvestri
Has anyone seen a problem with solder under chip components, in-between the glue and the component or in-between the mask and the component? We seen both. What could be causing this? This has only been detected on one of our products. All the rest w
Electronics Forum | Sat Mar 25 12:13:13 EST 2000 | JAX
Robert, Have you checked for any form of contamination that might cause the solder not to adhere to the balls? From the pictures you have on the net it appears that you have too much solder on the pads. What thickness is your stencil? If it is to sp
Electronics Forum | Tue Feb 06 18:19:30 EST 2001 | davef
Now that's surprising that your board fabricator would say the mask was cured properly [without even inspecting the boards]. I wonder if they can backup those BOLD words when testing your boards with the webbing problem. The reason you can�t find t
Electronics Forum | Thu Jul 10 09:55:47 EDT 2003 | davef
A reading of the pictures is: A1: Looks like pad [B1] is smaller than the other pads. It�s weird that the pads are such different colors. A2: Looks like pad [B1] is smaller than the other pads. Solder mask opening [B1] is misregistered and seems s
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F
Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad
Electronics Forum | Wed Jun 25 06:43:06 EDT 2003 | cyber_wolf
We are currently producing a board for a customer that has about 400 gold fingers that get wire bonded after the assy. leaves our facility. We have tried many different approaches to ensure that we are not getting solder on the gold fingers. Nothing
Electronics Forum | Fri Jun 08 08:26:14 EDT 2007 | davef
Testing for solder mask cure: Search the fine SMTnet Archives, for instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=15726 Residue after wave: Water in your wave soldering flux may cause your NC flux residue to go white. Indium W
Electronics Forum | Thu Jul 09 11:20:24 EDT 1998 | Justin Medernach
| I am looking for a little enlightement with an issue that we have been seeing. We have printed curcuit board with multilayer and HAL finished. | After reflow soldering, we have often "blister phenomenon". | Our reflow profile is normal. Factory
Electronics Forum | Tue Mar 23 14:08:57 EDT 2010 | davef
You have what looks to be blisters/delamination. Use IPC-A-600F as a guideline for acceptance. Usually, we start from the opinion that blisters/delamination as a fabrication issue, even if it appears during solder processing. Often blisters/delam
