Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis
Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in
Electronics Forum | Wed Aug 28 10:16:12 EDT 2002 | Jim M.
Sam We install a lot of die in the SMT room using same process as SMT parts.Water soluble solder paste is used for attachment of die to ceramic and boards. Biggest problem i found is the adjustment from installing the die in the bonding area. The t
Electronics Forum | Sat Oct 02 20:19:19 EDT 1999 | John Dwinell
| | I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Ir
Electronics Forum | Mon Apr 26 12:16:45 EDT 1999 | Justin Medernach
| Hey Guys! | | Look what I get to try and do this week! I got handed a cardboard box on Friday afternoon with the parts and 20 of these little jewels! That's both sides of the board by the way... | | Whoever laid this out, I'd like to go and do a
Electronics Forum | Thu Jun 25 14:41:07 EDT 1998 | Earl Moon
| Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Handb
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Electronics Forum | Mon Jun 07 11:10:56 EDT 1999 | Brian Wycoff
| | | | | | | Geez, those test guys are always whining about via holes, aren't they? I even had one test guy go over to our finals/add-on department and instruct everone to look for unfilled vias and fill them by hand! Without consulting the area
Electronics Forum | Fri Jun 26 11:27:12 EDT 1998 | Earl Moon
| | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Han
Electronics Forum | Fri Jun 26 15:37:50 EDT 1998 | Justin Medernach
| | | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection H
