Electronics Forum | Thu Jun 03 14:41:06 EDT 1999 | JohnW
| | | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. W
Electronics Forum | Thu May 18 21:46:21 EDT 2000 | Dave F
Scott: First, it's neat that you do cartridge monitoring on you staff. We do that once a year. We (and I assume others) are responding to OSHA requirements: Lead CFR 1910.1025 permissible exposure limits for lead, provisions for medical examinati
Electronics Forum | Mon Sep 21 21:21:32 EDT 1998 | Steve Gregory
| am working on the design of a showboard to demonstrate our | assembly capabilities. we are working with double sided assemblies involving BGAs and CSPs. could someone suggest | types of BGAs/ CSPs (type, name, I/O, etc)that would be a challenge t
Electronics Forum | Mon Oct 14 12:56:50 EDT 2002 | davef
His technical contribution to the forum. From these 24 postings, we can see that 75% of Sean�s postings have a decided commercial bent, as followings: * Could be argued that the posting is a good technical response. Percent of postings 25%. * Could
Electronics Forum | Tue Jul 28 09:15:49 EDT 1998 | Justin Medernach
| We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ============= | 1) 16 layer (4 power, 4 gnd, 8 signal) | 2) gold on nickel finish | 3) ceramic BGA with eutec
Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F
| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly
Electronics Forum | Tue Jul 28 17:23:58 EDT 1998 | Robert Steltman
| | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | | First some details: | | PCB & Device: | | ============= | | 1) 16 layer (4 power, 4 gnd, 8 signal) | | 2) gold on nickel finish | | 3) ceramic
Electronics Forum | Thu Jun 03 07:10:31 EDT 1999 | Earl Moon
| | To you all for comment and summary, | | | | The following things I like without endorsing (PCB/PCBA stuff - outside the great women in my life [many] and without [mostly]): | | | | 1) A good set of design rules | | 2) A good set of design rules
Electronics Forum | Sat Jun 05 00:27:54 EDT 1999 | Dean
| | | To you all for comment and summary, | | | | | | The following things I like without endorsing (PCB/PCBA stuff - outside the great women in my life [many] and without [mostly]): | | | | | | 1) A good set of design rules | | | 2) A good set of
Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef
DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b
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