Electronics Forum | Wed Feb 20 19:57:27 EST 2002 | davef
THIEVING * Layout: I�d guess the surface area of your thieves is not large enough. The pull from the thief is not great enough to over-come the pull from the connector pins and pads. Consider tripling the size of the thief. As you say, reducing t
Electronics Forum | Wed Mar 06 21:16:17 EST 2002 | davef
�What does 5 micrograms of chloride mean to me?� * With SIR testing, you can show no detrimental leakage currents under humid conditions, no corrosion, no metal migration, which are the big factors in figuring out electrochemical reliability. People
Electronics Forum | Mon Apr 01 17:50:31 EST 2002 | stefwitt
the good and bad days are normal results of statistics. You enter some variables like number of feeders, length of part numbers, day of the week, sexual satisfaction of the operator a.s.f. , you get some statistical distribution. It tells us that on
Electronics Forum | Wed May 15 13:11:26 EDT 2002 | fmonette
Hi Dason, Yes I was talking about the same paper. This is the best technical information available to clearly explain the physics of moisture diffusion inside a plastic package. Many of the guidelines contained in the current J-STD-033 are derived
Electronics Forum | Thu May 30 13:46:00 EDT 2002 | davef
Consider NOT getting involved in those little POS chunks of sheet metal. * They're expensive. * You never have the one you need. * Even if you DO have the item you need, you probably will not be able to locate it. * It's all but impossible to c
Electronics Forum | Thu May 30 10:59:41 EDT 2002 | Hussman69
Diamond/sqaure shapes are good for when you X-Ray the BGA as stated above. The only problem is if you you over print too much, you can get solder beading. I recommend round pads to avoid the beading and use X-Ray to make sure you reflow correctly.
Electronics Forum | Fri May 31 17:04:02 EDT 2002 | davef
We use boots / shunts er wutt ever you call them to protect solderable component surfaces from wave soldering. Not sure how it would work in your case try: * Kinnarney Rubber 450 Main St. P.O.Box 37 Mantua, N.J. 08051 609-468-1320 fax 7438 http://ww
Electronics Forum | Tue Jul 02 12:10:06 EDT 2002 | fmonette
Dason, Just a word of caution about your experiment. Evaluating moisture content by weight gain is a very simplistic model, based on the assumption that the moisture content is uniform across the package. In fact, recent technical papers have cl
Electronics Forum | Sun Sep 08 19:58:57 EDT 2002 | dasal
My specialty. Your right, Most corrugated contains S02 and the pallet is usually out gassing formic acid as well. Not a great environment for silver. Original press release follows: Reactive Polymers At AT&T Bell Labs, John P. Franey has developed
Electronics Forum | Sat Jan 04 09:02:17 EST 2003 | davef
Q1. What is the recommended stencil thickness to apply the proper amount of solder for 0603 components? A1. The proper amount of solder is determined by: * Metal content of the solder paste. * Stencil thickness. * Aperture opening. * Other factors,