Electronics Forum | Fri Aug 22 14:24:54 EDT 2008 | boardhouse
Paul, I would do two things, eval whole lot for any etching issues as shown above and scrap and two I would have your copper thickness checked, my guess your copper plating will be low. Check plating thickness in Via holes - if less then 8/10th's r
Electronics Forum | Wed Sep 24 19:18:53 EDT 2008 | ratsalad
We had a PCB vendor provide us with SAC105 plated HASL boards. They worked fine on the first pass through reflow. The second pass was not pretty. We couldn't get much of anything to solder to the board. That may not have been the alloy, it could
Electronics Forum | Thu Aug 06 19:20:09 EDT 2009 | boloxis
easy, just dip the ICs on a very weak solution of Nitric Acid, by very weak I mean like drops of Fuming Nitric acid in a half full DI water beaker. Place the beaker on a Ultrasonic bath and dip/shake the ICs in the solution in 5~ 10 seconds only. You
Electronics Forum | Sun Apr 04 00:51:01 EDT 2010 | jmelson
On the Xilinx chips, I am pretty sure these hairs are NOT tin whiskers. The solder in this particular build was SnPb, and pure tin would almost certainly melt at soldering iron temperatures. My theory is that slivers of the lead frame material, lik
Electronics Forum | Wed Feb 10 16:51:01 EST 2010 | flipit
Anyone using ENEPIG electroless nickel electroless palladium immersion gold? Am currently using selectively plated gold 25 micro inches in combo SMT/COB gold ball bonded product. Gold cost has increased over the years. Palladium cost is much lower
Electronics Forum | Mon Dec 27 07:12:54 EST 2010 | clampron
Good Morning Methos 1979, I have worked with the Mirtec MV2 and 3 for several years. I did perform some evaluation of the red/blue filters. We found it to be usefull for some specialty solder inspections but we found it most usefull for solder inspe
Electronics Forum | Mon Mar 19 22:09:38 EDT 2012 | davef
J-STD-003B prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes utilizing either tin/lead or lead-free solders. This standard is
Electronics Forum | Fri Apr 05 14:17:11 EDT 2013 | leemeyer
I have no idea why this limitation would be programmed in. Like I said before there a lot of wierd quirks whith this software and you may have just found one. Pre-assigning will not help if the software sees a mismatch between the feeder plate and th
Electronics Forum | Fri Sep 06 14:03:18 EDT 2013 | horchak
If you are a CEM you are setting yourself up for failure and will be left holding the bag. Flash gold has one purpose. It is a protective coating for the base medal to keep it from oxidizing. It is very thin and will be absorbed into the solder joint
Electronics Forum | Thu Oct 31 12:33:14 EDT 2013 | pbarton
You should have no difficulty with QFN or QFP parts when using non-RoHS solder. The QFP's are most likely to have tin plated leads and the metallisation on the QFN lands the same, or ENIG. Check the component part datasheets to verify the plating an
