Electronics Forum | Fri Feb 27 10:54:38 EST 1998 | Earl Moon
REVISITING MULTILAYER DIMENSIONAL STABILITY AND LAMINATE INTEGRITY It has been said we must learn it all over again and again about every four years. I know Lee Ritchey said that to me about high speed digital circuit design. The same seems true for
Electronics Forum | Mon Aug 13 21:04:15 EDT 2001 | davef
What??? You don�t have enough things to monitor? The origin of some profiles is mysterious. It�s probably good to try to understand such mysteries. Certainly, the important determinants in the design of your reflow profile are: * Paste you�ve sel
Electronics Forum | Thu Sep 06 10:34:21 EDT 2001 | Mike Konrad
Hi Jeff, Sean is correct. Although ultrasonic technology will work in post-reflow de-fluxing applications, you will receive concerns regarding ultrasonic �damage� to wire bonded components. Much has been written to combat this belief but the conce
Electronics Forum | Mon Sep 24 17:38:18 EDT 2001 | mparker
First question - do you have a rework station? If so, are you experiencing the same type of failures there? I have successfully used no-clean on uBGA's in the past. 6 mil solder bumps, 10 mil spacing. 88 sites. Are you reusing previously soldered uB
Electronics Forum | Fri Oct 19 17:41:21 EDT 2001 | Stefan
I used to love tweaking. I tweaked and tweaked until I got a master degree in tweaking. But than I had to teach others how to program a board and avoid tweaking. After all it does not go quite conform with ISO and other quality approaches. I investig
Electronics Forum | Sat Oct 27 12:01:32 EDT 2001 | Stefan Witte
Most of the machine suppliers Fuji, Siemens, Universal and Panasonic did regret that they were building glue machines. Applying adhesive compared to placing a component looks so simple, but it is not and the defect rate is higher than placing 1206 c
Electronics Forum | Fri Nov 23 05:52:45 EST 2001 | Wolfgang Busko
What Claude is saying may be right. But looking at it a bit different from the view of "senior management" this should be interpreted as depending on the salary the work itself is different and therefore the responsibility is different. It doesn�t na
Electronics Forum | Fri Mar 01 09:10:50 EST 2002 | caldon
Andrew- I look for usefulness in web sites.I hate having news mail sent to my email box. Having a site post technical information, links to useful stuff, and all around beneficial information is good. It seems to me the vogue thing on the Technology
Electronics Forum | Fri May 03 10:51:24 EDT 2002 | fmonette
Dave is correct. I am including additional information that comes from a recent posting on another industry forum : The proper guidelines for bag sealing are actually specified in the JEDEC standard EIA/JEP124 section 5.2.1 Packing moisture-sensiti
Electronics Forum | Tue May 21 20:27:05 EDT 2002 | davef
No N2. We could not fix a benefit for N2 in our minds. Just fold the excess bag material over to expell most air and then seal the bag. [Have you assessed the benefit of N2?] F Monette can tell you stories about little versus more pressure. If he
.gif)
