Electronics Forum | Thu Oct 31 12:33:14 EDT 2013 | pbarton
You should have no difficulty with QFN or QFP parts when using non-RoHS solder. The QFP's are most likely to have tin plated leads and the metallisation on the QFN lands the same, or ENIG. Check the component part datasheets to verify the plating an
Electronics Forum | Thu Oct 31 12:37:37 EDT 2013 | pbarton
You should have no difficulty with QFN or QFP parts when using non-RoHS solder. The QFP's are most likely to have tin plated leads and the metallisation on the QFN lands the same, or ENIG. Check the component part datasheets to verify the plating an
Electronics Forum | Thu Jun 26 06:14:16 EDT 2014 | allgood
We find sticking tape down to the tray wagon or to a base plate is Ok but not very repeatable - when you peel the empty off and stiock a new on e down you have to relocate it every time so some way of holding the strip in a repeatable way is better.
Electronics Forum | Fri Jan 30 00:41:04 EST 2015 | neeraj_iiser
Thanks a lot , my application is cryogenic in nature. I am trying to make a Sub-Angstrom resolution Thermal expansion sensor, whose components have been machined out of OHFC copper, and i needed to solder a manganin wire to one of the capcitor plates
Electronics Forum | Fri Mar 20 07:42:44 EDT 2015 | eezday
Dendrite growth is not typically associated with a flux reation but rather is a result of mechanical stress. The stress can be from any source including stress induced by other components, environment, plating or even bimetallics. Dendrites are most
Electronics Forum | Tue Aug 04 14:56:27 EDT 2015 | sarason
Adding to my previous message this could be solved fairly easily for the general case with a jig made from 3.2 - 4mm aluminium aircraft grade plate. you would machine the bottom side edges to give a 1.6 mm thickness, then machine the top side to leav
Electronics Forum | Fri Oct 16 12:41:29 EDT 2015 | deanm
Do you have a solderable surface (walls)? It looks like most walls have a silver arc at the top but some do not (especially the last link) which I interpret that it has been plated (in most cases). Is it possible that the component does not have suff
Electronics Forum | Mon Sep 19 01:57:28 EDT 2016 | shriram
Hi guys, Problem: Mid chip solder balling. Component affected: 0603 caps only Defect is PCB specific (Meaning only one PCB is affected as the aperture is standard for that component). As a containment I'll give a home plate design for the compo
Electronics Forum | Tue Oct 04 20:31:16 EDT 2016 | davef
IPC-7721, Section 6.1, Jumper Wires, Jumper Wire Selection #5 states: "Recommended wire is solid, insulated, plated copper wire, 22 to 32 AWG with a heat resistant insulation. Wire with tin-lead plating may be restricted due to environmental laws."
Electronics Forum | Mon Jun 12 07:52:21 EDT 2017 | tch
We have had this issue on our Delta 3 waves and determined that there are small pin holes in the solder pot. We had plates welded to the outside of our solder pot on the lead free wave and this bought us enough time until we could replace the wave, a
