Electronics Forum: pass (Page 67 of 142)

Inconsistent mounting on TOPAZ-X

Electronics Forum | Mon Nov 17 04:03:08 EST 2008 | griffin

If the whole board is shifted then it must be a problem with the clamping of the fixtrue to the machine or the board to the fixture, or the fiducial reading that is incorrect. Are the fixation of the board to the fixture the same in both programs? A

Ionic - MIL-P-28809A vs IPC TM650 (2.3.25C)

Electronics Forum | Wed Nov 19 06:02:22 EST 2008 | caerleon

Hi all, I have been in the game for near on 15 years and finally something has stumped me! As this site has always provided a wealth of knowledge and at times some amusement I have decided to post it here. Ok. My company uses a test method on an Om

BGA soldering problems

Electronics Forum | Thu Nov 27 10:55:51 EST 2008 | muarty

Hi Steve, Are you actually profiling the BGA itself? By that I mean have you, for example, drilled through the underside of the pcb into the balls of the BGA and attached a probe there? You may find that even although the topside components have a p

Barrel fill with Pb Free Wave Solder

Electronics Forum | Tue Dec 16 16:49:22 EST 2008 | scottd3

We ran into this problem before, on all of our models. We never quite found out the reason, we do know that if the PCB is passed through a reflow oven that is extremely dirty with evaporated solder paste flux, it will make it extremely difficult (or

Epoxy for holding large inductors

Electronics Forum | Wed Jan 14 13:38:38 EST 2009 | vleasher

I am attempting to identify a good epoxy to hold on larger parts on thru the reflow process for the opposite side. We currently dispense epoxy prior to second reflow on the corners of the component because the epoxy we use cures before reflow and doe

Damaged Components by Reflow Process (Process Window)

Electronics Forum | Wed Feb 11 00:13:55 EST 2009 | emmanueldavid

Smart, There must be an in-house system at Your end that any Parts intended to buy must undergone for Validation Phase in Qualification Process. At this phase Qualification Engineers to be acknowledge that each parts are meeting given TDS Specificat

QFN's and LGA's

Electronics Forum | Wed May 20 17:56:51 EDT 2009 | dyoungquist

I have attached a pdf showing the dimensions for the QFN we placed. First, The pins on the part are not only on the bottom side but also wrap around to come up each of the 4 sides of the part as shown in the side view in the attached pdf. This i

BGA Pad Cratering

Electronics Forum | Fri Jun 05 16:06:51 EDT 2009 | mjz289

This is from a section of an ALtera EP2SGX130-5 STRATIX 2 leadfree 1,508 ball BGA. What can be causing this? It is from an unused board (not assembled in a unit, or in the field, but it did pass electrical and function test. There are three of them i

Philips Comet L004 Feedback Error

Electronics Forum | Sun Jul 05 12:32:43 EDT 2009 | emanuel

While moving to a new location we had to remove the tables from a Philips Comet in order to be able to pass a narrow door. While attempting to calibrate the machine, during Warm-Up a strange error appears, sometimes almost immediately and sometimes a

Solder Wire Expiry Dates

Electronics Forum | Wed Aug 26 10:48:30 EDT 2009 | grahamcooper22

Some print expiry date on reels and some specify a shelf life on data sheets. Two main reasons are that the flux in the wire is a mix of chemicals and over time in storage these can react so soldering performance can be changed. Although I have to sa

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