Electronics Forum | Wed May 17 16:01:48 EDT 2000 | Janet Tietz
I work for a small assembly company that is starting to branch into SMT. I have been choosen to run the setup since I have the most computer skills and greatest knowledge of componets in the shop. However, I am finding out I need a lot more knowled
Electronics Forum | Mon May 08 01:47:56 EDT 2000 | Jack
Charles, I think the misplacement can be devided into 2 groups: 1. parts misplaced by machine 2. parts move as the X-Y table moves If you use the solder paster right, and the place force is properly setup, the second group will be definitely no exce
Electronics Forum | Tue Feb 06 18:12:46 EST 2001 | davef
Pete makes great points. Taking a slightly different angle, use your placement equipment's software to help you. It keeps track of the number of picks and attempts for each location. Study these numbers for a week and determine the capability of p
Electronics Forum | Tue Feb 27 18:10:55 EST 2001 | davef
I�m unclear about � "BB training"??? "BB candidates"? Is BB [Box-??] [Bhote-??] a Design Of Experiments technique like Taguchi? As a start, the following affect the "attrition rate": * Assembly machine program * Machine calibration and maintenan
Electronics Forum | Thu Mar 22 17:49:13 EST 2001 | davef
Sure. We use 9999 for our operator level security. We use a secret number [that we change periodically] for our next level of security, because we don't want people messing with our profiles. And we use an ever more secret number for our next leve
Electronics Forum | Tue Apr 24 02:07:27 EDT 2001 | joe
It's not so much of a change but a new investment. We have Siplace lines now, and very pleased with the performance. The reason for looking at the Mydata is to remove all the small stuff from the faster lines and reduce changeover times. The idea is
Electronics Forum | Tue Sep 19 09:34:33 EDT 2000 | Erick Russell
There are two places where Laser Soldering is used for rework. One is the low volume, high mix environment where the board value is high. The other is the high volume (regardless of mix) facility where fast process time and quick set-up is required.
Electronics Forum | Fri Jun 15 13:06:15 EDT 2001 | CPI
I Agree with Dave, Check spec on cap some devices have temp constraints (can exceed x degrees for more than x time or can not exceed a certain ramp rate). Check that then go through the rest of the process chances are its not your machine if no other
Electronics Forum | Thu Jun 14 14:01:11 EDT 2001 | Claude_Couture
I used to associate the mass of the assembly with the reflow profile. The greater the mass, the greater the quantity of heat you need to give the assembly. Most of the time you just need to reduce the speed of travel in the oven. Try different settin
Electronics Forum | Tue Jul 10 13:45:23 EDT 2001 | markhoch
We're stencil printing a Loctite 3614 Chipbonder adhesive, and we're using BioAct SC-10 presaturated wipes to clean the stencil after printing, without much luck. Operators are not able to remove all adhesive material left in the aperatures, and aft
