Electronics Forum | Thu Apr 29 11:07:03 EDT 2004 | arcandspark
You are right about the very poor support for smaller customers. I had told them we were looking for another paste and now they have sent the reginal manager and the US sales manager has come by to see what they can do for us. All they keep saying is
Electronics Forum | Sun May 09 11:42:23 EDT 2004 | valuems
Hello Sam We will send you a e-mail and try to explain the problem's that you have. The first one is the 386, it is not a reliable piece of equipment. It has out lived it life time. The next one is the software that MPM sells today ( 4.1y) for tha
Electronics Forum | Sun Feb 27 17:06:18 EST 2005 | Darby
This is the profile we came up with on a 1500 to satisfy the parameters suggested by Indium. This was on an FR4 1mm thick 4 layer pcb that I would descrbe as medium density, QFP, SOP, AL-CAP, TANTS, D-PAK, MINI SPRING COIL, SOT and CHIPS were all use
Electronics Forum | Thu Mar 24 07:06:06 EST 2005 | davef
There's a lot of comparison tables on the web. Here's one: Properties - Summary [A Winlow Circatex] Attribute||Hasl||Immersion Silver||Immersion Tin||Electroless Pd||OSP||Eless Ni / Imm Au Shelf Life (months)||12||12||12||12||12||6 Multiple Reflows
Electronics Forum | Tue Aug 23 22:50:09 EDT 2005 | adeline_ko
My process guy told me that. Due to black spot issue, brd with BGA must use electrolytic finishing. And when we had this finishing with plug via, the blister issue pop out. My supplier claim that this is due to the plug via. Which I don't know how
Electronics Forum | Mon Feb 06 10:12:30 EST 2006 | Yash Sutariya
Hi, I authored the presentation so I may be able to help you out with your Q's. 1. IPC is in draft stage for 4 new material specs. These are in the presentation. I would focus on IPC 4101/ 121 and /124. Match your current Tg requirement to the T
Electronics Forum | Tue Apr 25 09:43:35 EDT 2006 | TMC
I am in the process of profiling some 8"x10"x0.063" double sided boards in our 4 zone oven(4 top and 4 bottom heaters). Was wondering if I can create a profile so that the components on bottom side of a board do not reflow while the componets on top
Electronics Forum | Wed Apr 26 10:56:13 EDT 2006 | JEM
Mydata sales for TPSys 2.4 says and i quote" Reduce your setup and changeover times with new features like the ability to use auto teach for vision illumination, barcode loading of trays, factory wide sharing of vision package data.TPSys 2.4 contains
Electronics Forum | Thu Jun 29 08:31:03 EDT 2006 | MarkM.
Hello all, I have a dilemma at the moment with my CP4 pick and place positions. I get alot of parts in the rear of the machine and inside. I also as of late starting to get parts flying around on the boards once in awhile. I have checked pick positi
Electronics Forum | Wed Sep 27 17:49:41 EDT 2006 | SWAG
Open the rear door that has the cooling fans on it. Look at the wiper blade regulator, look toward the front of the machine about 8" or so and to then left 3"or 4". There should be a lexan cover/box over the board that has this pot. on it. If stil
