Electronics Forum: pass (Page 69 of 142)

Solder void underneath the mosfet

Electronics Forum | Thu Mar 25 11:30:33 EDT 2010 | Sean

Hello Rajeshwara, If not mistaken, the 25% solder void specification is for BGA...As I I as know, no specification given to mosfet component yet..I think you are right, I need to look at the stencil aperture in order to reduce the air trap underneat

IP1 and SSOP28

Electronics Forum | Sun May 23 21:33:42 EDT 2010 | ashley

"The part is picked up and head goes to it's xy location" Hello mickd, I believe VP had passed but machine is confused how to compensate & place. OS error normally associate with a faulty VME card. Please check the following :- VM1152 VM1730 VM193

BGA non wetting

Electronics Forum | Mon Sep 13 22:32:41 EDT 2010 | genesan

Hi all good morning and need advice from expertise here. One of my customer complain that they have constantly issues with one of their product and ask us to do cross section.The report show there was “no wetting to the PCB copper pad” and cause the

BGA non wetting

Electronics Forum | Mon Sep 13 22:58:49 EDT 2010 | genesan

Hi all good morning and need advice from expertise here. One of my customer complain that they have constantly issues with one of their product and ask us to do cross section.The report show there was “no wetting to the PCB copper pad” and cause the

contact 3av head homing errors

Electronics Forum | Fri Sep 24 16:01:07 EDT 2010 | dougt

I remember this problem but can't remember exactly what the reason was. It might have been the wrong pullup resistor on the MEI interface board used for the home photo on the y axis. You are right, after a couple hours the machine would work fine.

AOI-problems lifted lead on qfp-100

Electronics Forum | Sat Oct 02 15:26:59 EDT 2010 | rway

Possible, but difficult. What algorithm programs are you referring to? Mirtec and YesTech both utilize algorithms in their respective software. The algorithm is simply a series of instructions to perform the inspection. In this case, rules-based,

PCB Solderability

Electronics Forum | Fri Oct 29 11:23:51 EDT 2010 | pfloh

Just for your reference. If you need to check for surface contamination, then we shall go for microscope inspection at different modes. But this will not reflect on actual PCB performance. Solderability test will still a good option if PCBA is expe

Mirtec programming discussion

Electronics Forum | Fri Nov 05 18:47:31 EDT 2010 | eadthem

I'm guessing when you say bare board you mean wet paste only? When you say the pads move slightly are your boards warped at all at the Vscore? What we do is use per modual fids. first you delete or don't make panel fids and then theres a option wh

Way to solve PCB warpage

Electronics Forum | Sat Dec 18 08:23:33 EST 2010 | remullis

I experienced warpage on a 7'x 13" long board, unfortunately my oven does not have center support. I use stiffeners on both of the short ends. It fixed my problem. Some of the things I was experiencing with the warpage on the second pass were placem

Patented Leadless, Fluxless Solder Alloy join different material

Electronics Forum | Thu Jan 20 00:22:07 EST 2011 | yangloh

Dear Industry experts, We have just developed a leadless, fluxless solder that can join various metals ) Al, Cu, brass, Steel, stainless and Titanium) and Ceramics ( Ruby, Quartz, Sapphires, glass, TiO2, etc) We intend to explore electronics and


pass searches for Companies, Equipment, Machines, Suppliers & Information