Electronics Forum: setup (Page 69 of 161)

product changeovers

Electronics Forum | Thu Jul 01 21:50:32 EDT 1999 | Big K

I am currently looking into ways to decrease SMT changeover times. I work in a high mix-low volume factory. We use Fuji CP's and IP's for SMT production. I would appreciate hearing from anybody that has some proven methods for reducing setup/changeov

Re: Adhesive dispension

Electronics Forum | Mon Mar 01 23:57:00 EST 1999 | Erhan Kaya

"DIP, VCD" -> "smt secondary" type of process flow. In that case, dispensing becomes a must. Dispensing needs less setup than printing, but takes longer. So, for a prototype manufacturer, dispensing becomes the best choice. Sometimes a machine dispe

Blood letting on stencil printer

Electronics Forum | Tue Oct 13 09:08:54 EDT 1998 | Earl Moon

We suffered our first blood letting because of razor sharp edge clamps (DEK 265LT) and operator giving it the finger. While positioning magnetic tooling pins, one of our best slipped and really sliced off a part of his main digit. This will impact hi

Re: Re balling BGA

Electronics Forum | Sun May 31 15:57:51 EDT 1998 | Allen

I came across your question and have a good reply for you: We have been using a system to reball our BGA's made by a company called Galahad. They have been working with Hepco for distribution. Give them a call at 408-738-1880. The system is around

Re: Environmental Issues / Lead Thread On IPC

Electronics Forum | Mon May 25 08:57:57 EDT 1998 | Dave F

| Y'all: IPC set-up a site addressing the environmental issues of the printed circuit fabrication industry. Some of it is interesting and applicable to the assembly business as well, even though not aimed directly at assemblers. IPC has recently t

Bottom side bridging

Electronics Forum | Fri Apr 10 14:10:13 EDT 1998 | Jim Hoxie

We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. The f

Bottom side bridging

Electronics Forum | Fri Apr 10 14:08:51 EDT 1998 | Jim Hoxie

We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. The f

Wave SPC

Electronics Forum | Wed Sep 26 16:31:30 EDT 2001 | davef

Wudduya mean ya can�t replace that ol� John Trieber? We agree. * Waverider thingies are best used to set-up process and in machine start-up. * Monitoring product characteristics is expensive, gives little information, and is so sloooow. [Plus we tu

Mydata for prototyping?

Electronics Forum | Mon Jan 14 19:22:54 EST 2002 | wsanita

The great thing about Mydata is the ability to put small strips of components on the Y-table. Takes only a few minutes to setup. I build mainly protos and small lots. The y axis is the table. The head is the x. Any problems you may have heard of were

Another Wave Solder Question....

Electronics Forum | Mon Jan 28 07:30:21 EST 2002 | cnotebaert

Is it just certain locations on the board, or is it random, does it occur on every board, does this happen on any other products you have been running? If this occurs only on the 1 board and in random locations I wouldn�t say its your wave setup. I


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