Electronics Forum: pass (Page 72 of 150)

BGA soldering problems

Electronics Forum | Thu Nov 27 10:55:51 EST 2008 | muarty

Hi Steve, Are you actually profiling the BGA itself? By that I mean have you, for example, drilled through the underside of the pcb into the balls of the BGA and attached a probe there? You may find that even although the topside components have a p

Barrel fill with Pb Free Wave Solder

Electronics Forum | Tue Dec 16 16:49:22 EST 2008 | scottd3

We ran into this problem before, on all of our models. We never quite found out the reason, we do know that if the PCB is passed through a reflow oven that is extremely dirty with evaporated solder paste flux, it will make it extremely difficult (or

Epoxy for holding large inductors

Electronics Forum | Wed Jan 14 13:38:38 EST 2009 | vleasher

I am attempting to identify a good epoxy to hold on larger parts on thru the reflow process for the opposite side. We currently dispense epoxy prior to second reflow on the corners of the component because the epoxy we use cures before reflow and doe

Damaged Components by Reflow Process (Process Window)

Electronics Forum | Wed Feb 11 00:13:55 EST 2009 | emmanueldavid

Smart, There must be an in-house system at Your end that any Parts intended to buy must undergone for Validation Phase in Qualification Process. At this phase Qualification Engineers to be acknowledge that each parts are meeting given TDS Specificat

QFN's and LGA's

Electronics Forum | Wed May 20 17:56:51 EDT 2009 | dyoungquist

I have attached a pdf showing the dimensions for the QFN we placed. First, The pins on the part are not only on the bottom side but also wrap around to come up each of the 4 sides of the part as shown in the side view in the attached pdf. This i

BGA Pad Cratering

Electronics Forum | Fri Jun 05 16:06:51 EDT 2009 | mjz289

This is from a section of an ALtera EP2SGX130-5 STRATIX 2 leadfree 1,508 ball BGA. What can be causing this? It is from an unused board (not assembled in a unit, or in the field, but it did pass electrical and function test. There are three of them i

Philips Comet L004 Feedback Error

Electronics Forum | Sun Jul 05 12:32:43 EDT 2009 | emanuel

While moving to a new location we had to remove the tables from a Philips Comet in order to be able to pass a narrow door. While attempting to calibrate the machine, during Warm-Up a strange error appears, sometimes almost immediately and sometimes a

Solder Wire Expiry Dates

Electronics Forum | Wed Aug 26 10:48:30 EDT 2009 | grahamcooper22

Some print expiry date on reels and some specify a shelf life on data sheets. Two main reasons are that the flux in the wire is a mix of chemicals and over time in storage these can react so soldering performance can be changed. Although I have to sa

PCB Pad become brownish after IR reflow

Electronics Forum | Fri Sep 18 09:18:06 EDT 2009 | ysutariya

Also, it wouldn't hurt to perform SERA testing to determine the amount of free tin to begin with. From what I remember, I think you need 30 microinches of free tin to ensure success. XRF won't give you an accurate thickness reading as it counts the

AOI for solder inspection

Electronics Forum | Sat Nov 07 10:09:52 EST 2009 | ramses2001

Hi Nemo, In my factory we have an offline AOI from VISCOM for two SMT lines. It's not so easy to program, but the results are very good. Anyway you should have to think that an AOI system needs a human inspector and a technician to debug the program


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