Electronics Forum: .0 (Page 8 of 7889)

Re: Stencil for 10 mils IC

Electronics Forum | Mon Nov 13 16:24:49 EST 2000 | Darby

Depending on the designers pad size, I generally go for 0.010" aperture with 0.010" spacing - stencil thickness 0.005". This combo with metal squeegees and the "usual suspects" of printer set up and placement details should you you hassle free.

Re: solder balling

Electronics Forum | Wed Aug 09 04:09:04 EDT 2000 | Jarno Py�ri�

Hello. I think, good stencil apertures is 80% from pad. And stencil thickness is 0.15mm - 0.20mm. I use 0.15mm thick stencil almost every pcb. Sorry my very bad english but i too learning. :)

Searchin' For Tooling Pins

Electronics Forum | Tue Aug 04 08:29:06 EDT 1998 | Dave F

We are looking for source(s) for tooling pins: 1 Stainless steel pin 2 0.120" diameter, 0.250-0.375" long 3 Press fit

Flash 5.0

Electronics Forum | Mon Feb 04 08:29:43 EST 2002 | jax

Is there something I need to do to keep the Flash 5.0 download menu from popping up on my screen every few minutes? I have a higher version already loaded and do no want to download 5.0, but the constant prompting to do so is annoying.

0.4mm pitch CSP Dummy Component

Electronics Forum | Wed Mar 06 07:13:23 EST 2002 | PeteC

nope, only placed 0.75mm pitch myself. I looked around some data sheets and did not find any 0.4mm.

What is Cu-EFTEC 64T?

Electronics Forum | Thu May 06 17:23:02 EDT 2004 | davef

Ah, here it is: EFTEC-64T. A commercial leadframe material with the nominal composition of Cu-0.3Cr-0.25Sn-0.2Zn

GDM 0603 nozzle type?

Electronics Forum | Tue Mar 01 03:25:33 EST 2005 | bing

We are using a GDM with a linear piston pump fitted to dispence adhesive on 0603's. Use Universal part number 43273801 needle with a 42346504 piston. The single needle dimentions are 0.010 ID, 0.028 OD, 0.005 stand off

0.5 mm pitch BGA

Electronics Forum | Wed Mar 02 10:24:48 EST 2005 | Guest

Balls are 0.30 mm diameter, with a height of 0.24 mm It's a 8*8 mm 184 pins BGA.

Component Package/Classification

Electronics Forum | Wed Apr 13 08:00:57 EDT 2005 | davef

Dimension mm (LXW)||JIA||EIA 1.0X0.5||1005||0402 1.6X0.8||1608||0603

Solder Volume for Lower Profile PBGA

Electronics Forum | Thu Sep 29 20:26:58 EDT 2005 | DasonC

Any aperture/stencil thickness suggestion to provide a rigid solder joint for 0.8mm pitch PBGA with 0.4mm ball diameter. The pad is based on IPC7095 and it is 0.3mm. Thank!


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