Electronics Forum | Tue Jul 01 07:08:33 EDT 2003 | iman
suggest you check the preheat conditioning in the wavesolder process is sufficient, as this is the main culprit for micro-crack CAPs ?
Electronics Forum | Mon Mar 08 20:22:05 EST 2004 | davef
Wayne: Please describe the location and angle and direction of the crack relative to the board.
Electronics Forum | Wed Aug 18 08:58:49 EDT 2004 | M.Enright
We are finding cracked capacitors at both first pass and second pass.
Electronics Forum | Tue Aug 30 21:34:45 EDT 2005 | davef
Describe the location and orientation of the cracks.
Electronics Forum | Thu Sep 24 06:30:28 EDT 2009 | cathtee
Is there any vision system to check for substrate crack?
Electronics Forum | Sat Jun 19 08:32:49 EDT 2010 | davef
Please describe the location and appearance of the crack
Electronics Forum | Wed May 22 11:40:46 EDT 2019 | emeto
We mostly observed the flex cracks which were not visible.
Electronics Forum | Tue Sep 10 01:56:53 EDT 2019 | itrueriko
I got solution to manufacturer to find out the crack of MLCC if the manufacturer need it.
Electronics Forum | Mon Jun 30 10:52:36 EDT 2003 | Bob
Suggest you ask vendor for a failure analysis. Ceramic chips have specific signatures for mechanical or thermal shock cracking. The vast majority of failures are due to mechanical flex. Depanelization and secondary operations such as hand insertion
Electronics Forum | Mon Jul 07 00:11:10 EDT 2003 | praveen
if the capacitors are placed very near to the edge and their position is 90 deg than it may cause crack.4thly if the reflow ramp rate is more than 3 deg C then it may crack. 5th ly if the solderin tip temp. is very high and soldering bit is very thi
