Electronics Forum | Wed May 18 07:22:06 EDT 2005 | davef
Wire bonds don't stick when bonded * Check pull and shear strength. * Depending on point of failure, review parameters. * Listen during bonding, if there is a high pitch buzz, there is vibration in the system somewhere, "seek and destroy". * Get the
Electronics Forum | Wed Mar 29 18:17:16 EST 2000 | David
Does anybody out there have experience building electronics assemblies with DCA (Direct Chip Attach - bare die onto PCB) and wire bonding? - What Die Bonder/Dispensing Machines are recommended? - What brand conductive epoxy were used to attach die?
Electronics Forum | Sun Jan 22 09:44:17 EST 2006 | davef
Wire bonding is a die connect methodology that runs either gold or aluminum wires between pads on the integrated circuit to either a lead frame or pads on a printed circuit board. For more look here on Daan Terstegge's excellent link page http://www
Electronics Forum | Fri Sep 27 11:20:21 EDT 2002 | davef
Mar, The previous post makes the best point. Your finish spec depends on the COB process you plan to use. Is your process: * Gold wire bond * Aluminum wire bond * Flip chip * Er, watt
Electronics Forum | Tue Feb 08 11:14:45 EST 2005 | George
Have a customer that needs to find someone that can do Chip on board Wire bonding automated only. You folks know of anyone? We are in the Newengland Area. You know, where the Patriots reside?
Electronics Forum | Thu Feb 26 10:06:12 EST 2009 | bandjwet
Does anyone know of any vendors who can supply "dummy" parts to practice ball wire bonding of gold to help train/certify operators? Thanks BWET
Electronics Forum | Thu Jan 06 23:07:48 EST 2011 | essohn
Hello~ I need your expoertised experience. Do you have any experience of Saponifier influence on Al pad for wire bonding. We have a porblem of no wire bonding in use of saponifier in order to remove clean type flux. thanks in advance
Electronics Forum | Fri Nov 27 02:09:50 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Fri Nov 27 02:11:17 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Wed Jul 29 16:04:03 EDT 2020 | emeto
Very interesting. Looking at the wire bonding, it seems that it is all normal.