Electronics Forum: .2.0 (Page 8 of 11)

Re: uBGA

Electronics Forum | Fri Oct 16 21:07:31 EDT 1998 | Scott McKee

| I need the following information on uBGA's - body size, ball pitch and ball diameter. Are they a plastic package (with the resulting moisture sensitivity of a PBGA)? Also, does the uBGA put any special requirements on pick and place equipment? |

Solder balls - Pb wave soldering

Electronics Forum | Thu Aug 12 13:34:03 EDT 2004 | gregoryyork

Yes unfortunately solder resist again, getting boring I know. That green stuff on the boards causes all kinds of problems if not applied correctly. Can't blame the flux (as usual) or the process as he has tried all varients to no avail and therosin s

Quad ZCR 941 and Lead Free?

Electronics Forum | Mon Jun 20 10:59:18 EDT 2005 | Jason Fullerton

Extra cooling is better (Alpha recommends -3 to -7 degC/sec) for cosmetics. Less chance of s o called 'cooling lines' that look similar to 'cold' tin-lead joints. (Seems a bit steep to me - I worry about the risk of cracking ceramic caps.) Might be

Re: Missalingment 0402 Capasitor by Vision on TCM1000

Electronics Forum | Fri Oct 01 06:45:36 EDT 1999 | JAX

| Hi, | | We are running 0402 component on the TCM1000 and we find that teher will be missalignment on 0402 Capositor. We have identified that the missalignment is caused by the wrong information from the vision system while doing vision centering.

Re: Missalingment 0402 Capasitor by Vision on TCM1000

Electronics Forum | Fri Oct 01 07:25:05 EDT 1999 | Wolfgang Busko

| | Hi, | | | | We are running 0402 component on the TCM1000 and we find that teher will be missalignment on 0402 Capositor. We have identified that the missalignment is caused by the wrong information from the vision system while doing vision cente

Stencil for BGA re-balling

Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef

By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11

smt codes

Electronics Forum | Tue Aug 24 23:04:14 EDT 2004 | pdeuel

If this code is on a ceramic cap then it is a 0.1uf cap. We have a conversion charts that list most all codes. Useing the last 2 digets only determine the value. The capatol letters A thru Z are given specfic numerical value. Example A0 is 1.0pf, A1

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Tue Sep 21 13:12:56 EDT 1999 | Dave F

| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | Greg: I was going to link you to the IPC land pattern c

Agilent SJ50 .dat file

Electronics Forum | Sat Dec 12 04:21:13 EST 2009 | nkohler

Hello, We use SJ50 serie AOIs. I made a program which watches the .dat file and if an algorithm changes then my program makes a log file from the parameters of the modification. I know some numbers are which parameters, but I don't know all. I write

Double-sided reflow with a Altera 240-pin RQFP

Electronics Forum | Mon Jun 30 16:35:13 EDT 2003 | davef

Hi Steve We don�t double reflow this part. We wouldn�t consider it without a fixture or some other support. You know that sound, the almost involuntary sound that patrons in a restaurant make when a waiter drops a glass or a tray? It�s kind of an


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