Electronics Forum | Mon Aug 02 18:46:33 EDT 1999 | Jim Blankenhorn
| | Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board. | | If you know what component your'e going
Electronics Forum | Fri Jul 16 10:55:54 EDT 1999 | Jeff Ferry
We have been asked to rework several thousand bare circuit boards. A design change now requires 2 chip components where 1 was originally required. Round test pads near this area will be used to complete this circuit rework, however these test pads a
Electronics Forum | Thu Jul 22 03:58:28 EDT 1999 | George Verboven (Process Engineer)
| We have been asked to rework several thousand bare circuit boards. A design change now requires 2 chip components where 1 was originally required. Round test pads near this area will be used to complete this circuit rework, however these test pads
Electronics Forum | Tue Aug 04 12:32:13 EDT 1998 | Bob Willis
The design rules for solder thiefs are that the extra pads must be bigger than the proceeding pads to be worth while as a minimum guide the pad is 3x the size of the proceeding pad so if the pad is 0.030" the thief would be 0.090" wide. As steve has
Electronics Forum | Mon Sep 17 09:35:08 EDT 2001 | floydl
Based on your research, what is the pad and stencil design that you recommend for 0201 assembly?
Electronics Forum | Wed Nov 07 07:31:20 EST 2001 | steven
what is ideal or minimun spacing in between 2 pads to avoid bridging? thanks
Electronics Forum | Wed Oct 23 14:33:44 EDT 2002 | lhoang
Any one encountered the problem such as poor conductivity when the silkscreen mis-registrated on the solder pads ? Thanks; Linh
Electronics Forum | Sun Nov 03 08:28:29 EST 2002 | davef
We have had poor solderability from silk screen being on pads, but have never measured the conductivity.
Electronics Forum | Fri Dec 27 09:45:04 EST 2002 | emeto
what exactly do you mean by big thermal pad?
Electronics Forum | Mon Feb 03 22:48:00 EST 2003 | vinesh
Hi all, We are using small CSPs (10x10mm) in one of our products which has a big ground pad in the center (7x7mm). The maximum voiding allowed on this big pad is also no greater than 25% which we are finding very hard to achieve. The centre pad ha
