Electronics Forum | Fri Oct 01 06:02:43 EDT 1999 | Bach Huss
Hi, We are running 0402 component on the TCM1000 and we find that teher will be missalignment on 0402 Capositor. We have identified that the missalignment is caused by the wrong information from the vision system while doing vision centering. The sy
Electronics Forum | Fri Sep 05 06:17:36 EDT 2014 | edriansyah
Hi, We have a problem with our BGA Pad. Our PWB manufacturer make the BGA Pad in irregular form. some big, some small. Please see the picture on attachment. BGA Detail BGA Pitch 0.5 mm BGA Ball 0.3 mm BGA Pad (big) 0.2 mm (as per gerber) BGA
Electronics Forum | Tue Jun 17 01:27:25 EDT 2003 | Dreamsniper
Hi Guys, I need your opinion here. Has anyone tried doing this Process: Bottomside Process first which means gluing the chip components then reflowing the Glue instead of Curing them, then Topside process which is solder paste printing then compone
Electronics Forum | Wed Jun 03 15:45:36 EDT 2015 | ldempsey
Well, it took me a while but I had a look at some gerbers. On a PCB with neighboring 0402's 0.006" apart, and paste reduced 0.75mil on each side, I get lots of bridging. On a later rev of the same PCB, we have neighboring 0402's 0.018" apart,and pa
Electronics Forum | Mon May 20 16:15:48 EDT 2019 | davef
Resources are: * IPC-7525A - Stencil Design Guidelines, 3.5.2 Step-Up Stencil This type stencil is useful when it is desirable to print thicker solder paste in a small portion of the stencil. An example would be a ceramic BGA where it is necessary t
Electronics Forum | Mon Jan 14 12:28:06 EST 2008 | swag
We are in North Western U.S. I like 2.6 better (for our mix of builds, anyway). 1.0 works great on PTF parts such as fine pitch QFP's but I don't like it for chips. It's too picky and we wind up forcing parts to the 4.0. We have another GSM dual
Electronics Forum | Tue May 18 21:43:02 EDT 2010 | ashley
Hello mickd, 1) The EL data & Vision_type is NOT necessary when using MCS30 for IP1 machine. note : your input of the above might have cause confusion during VP, hence the OS error. 2) I would suggest the following... 2a) lower the Lead_check_are
Electronics Forum | Wed Apr 01 10:52:59 EDT 2015 | superlen
Oh, I forgot to add a sample of what my export looks like. Note: that I don't have anything in the VERSION block & I wonder if this might be a problem. [VERSION] [PCB] Unit System = MILIMETER Coordinate = LOWER RIGHT Rotation = 0 Placement Ori
Electronics Forum | Fri Aug 07 07:55:30 EDT 2009 | robhs
Hi. We are planning a production run of a board that utilises the SEMTECH SLP2710P8 8-pin device (2.7 x 1.0 x 0.58mm). The part orientation on the board necessitates that the squeegee print direction approaches the stencil apertures on the long side
Electronics Forum | Thu Aug 12 13:34:03 EDT 2004 | gregoryyork
Yes unfortunately solder resist again, getting boring I know. That green stuff on the boards causes all kinds of problems if not applied correctly. Can't blame the flux (as usual) or the process as he has tried all varients to no avail and therosin s
