Electronics Forum: 0201 and pad (Page 8 of 43)

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 20:12:41 EST 2006 | davef

We don't have a gap between the lead and the pad after a SM joint is soldered. On our boards, this space is filled with the solder intended to attach the component to the board. How high do components sit above the surface of a board? Most people a

Re: Standard pad sizes for reflow and wave

Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian

| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 10:10:50 EST 2006 | M. Sanders

I'm sorry, Dave - I didn't make myself very clear. Yes, this space (not really a "gap") is filled with solid solder. For instance, if you place a gull-wing component in solder paste, after reflow, there will probably be a thin film of solidied solder

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 15:10:50 EST 2006 | M. Sanders

Unfortunately, I don't have a copy of IPC-A-610 D on hand, however, I believe in IPC-610, this �floating height� between lead and pad has no maximum specification restriction. As long as there is no voiding, it is still acceptable for all 3 classes.

Re: Standard pad sizes for reflow and wave

Electronics Forum | Tue Sep 07 09:11:33 EDT 1999 | Dave F

| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 11:46:57 EST 2006 | slthomas

IPC 610 *C* states that the solder thickness requirement is a properly wetted termination is evident. Fillet height is another aspect and is usually specific to the package but is some function of solder thickness plus a percentage of lead height. D

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 20:30:22 EST 2006 | davef

Your customer is so poorly educated that you should decline their work, because this will not be the last time they waste your time with their cockamamey theories.

"Gap" in completed solder joint between lead and pad

Electronics Forum | Thu Nov 30 14:49:54 EST 2006 | M. Sanders

Dave, Thanks - I couldn't agree with you more. Unfortunately, our "bean counters" have a different frame of mind.

"Gap" in completed solder joint between lead and pad

Electronics Forum | Fri Dec 01 10:18:10 EST 2006 | realchunks

You're right Hussman, I kinda missed the follow thru on that one! Sorry for any confusion on my part boys. Huss, you going to APEX this year? We missed ya last year. L.A. this year....boo!

Re: Standard pad sizes for reflow and wave

Electronics Forum | Fri Sep 03 03:56:41 EDT 1999 | Wolfgang Busko

| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes


0201 and pad searches for Companies, Equipment, Machines, Suppliers & Information