Electronics Forum | Tue Feb 08 14:49:23 EST 2000 | Travis Slaughter
I have never tried this and wouldn�t really even want to consider it. Epoxy generally cures at around 160c in a fairly short amount of time, solder paste requires much more time and a peek temperature of about 210c or more in some cases. Curing you
Electronics Forum | Tue Oct 05 02:47:01 EDT 1999 | Eric
| Hi everyone, I need some help on the whole process of double sided surface mount. We have been doing surface mount for about 3 months and we're getting ready to take on our first doule sided board. I just need some step by step process regarding so
Electronics Forum | Wed Jun 03 08:46:32 EDT 1998 | Ryan Jennens
Thanks everybody for the help! We are still working on the bottom side, but the top side solder balling seems to have gone away for now. We flattened out the middle soak zone of the profile, so that rather than an even ramp up, the board heats quick
Electronics Forum | Mon Mar 30 15:30:24 EST 1998 | Keith Schermerhorn
| I am specing out a desk-top type SMD proto-typing and | reworking machine for low volume application. Capabilities | to 10 mill pitch on a 160 lead quad pack are required. | Any suggestions? | Thanks,
Electronics Forum | Thu Jan 22 03:18:02 EST 1998 | Eldon Sanders
I'll bet the rate of temperature change may be the problem. A large black thin package will heat quickly, and the package peak temp will be greater than what you measured on the board. The bottom of the package will heat slower than the top, creati
Electronics Forum | Mon Jan 21 09:27:02 EST 2002 | JohnW
Here's a question for you to mull over. I've got a PCB that is 4 millimeters thick, that's about 160thou of USA money if you like it that way. The question is IPC reg's for hole fill say it should be a min of 75% hole fill and 50% on ground planes. A
Electronics Forum | Tue Jun 04 16:12:41 EDT 2002 | Bob
The original profile had a higher ramp rate, and the apertures were 100%. The ramp rate is now much gentler and the addition of a small soak area around 160 � 170 degrees should burn off any excess flux. Appertures are now smaller and we get no leac
Electronics Forum | Mon Aug 26 23:35:08 EDT 2002 | Dave
Hey there, we use... Hmmms... we use a 6 hour paste I think from sci-tech or something that sounds like that, ws160a. as a rule what I paste up first thing, I want in the oven just after lunch, so about 4-5 hours. anything over that and your playin
Electronics Forum | Mon Nov 25 12:32:20 EST 2002 | davef
Now that is a BIG step. Stencil type: * A metal squeegee is fine with stepped stencils. * A rubber squeegee is fine with stepped stencils. Comments on step stencil "keepouts" are: * Use an ample space around the stepped down component pads that is
Electronics Forum | Fri Jan 03 15:17:18 EST 2003 | jonfox
We use this for our measurements: N=(17000(D^2-d^2))/(C*P) N=number of parts on reel D=OD of carrier tape on reel (inches) d=OD of reel core (inches) C=thickness of carrier tape (mils) P=pocket pitch (millimeters) example: 6"OD on 3" core of 40-mil
