Electronics Forum | Tue Dec 17 12:53:28 EST 2002 | russ
You looked one page to far in the IPC book! Fillet height of 75% is acceptable for all 3 classes. Per IPC 610 rev. C Section 6 table 6.2. A. Circumferential wetting on Primary side (top)between lead and barrel (not anualar ring) Class 1 Not spe
Electronics Forum | Tue Aug 07 01:16:27 EDT 2001 | mugen
When I was reading the smartsonic fantasy, I ended hospitalized for infectious laughs, and side split'in stitches..... Now that cold reality has eased my pain, I must with calm headed purpose, mark my agreement to the Mr.Sean, that salespersons can
Electronics Forum | Wed Jun 26 00:49:52 EDT 2002 | ianchan
Steve, I'd second Daan's opinion. BGA profile we use gets a peak of 210deg-C to 223deg-C (but that's using our WS paste unique characteristics) with reflow zone holding time of 45-60sec. We had 6 PBGA and 2 ceramic BGA on a 6 layer PCB. typical p
Electronics Forum | Fri Jul 29 19:12:30 EDT 2005 | Jason Fullerton
In the true sense of the term, tombstoning can only occur during reflow. Now, if your solder joints are cracking during thermal cycling and opening on one end you still have a problem - it just isn't "tombstoning". What laminate are you using on yo
Electronics Forum | Fri Mar 26 15:36:50 EDT 2010 | krish_bala
Hello Graham, We are currently using Tacky Gel Flux during our replacement process. We dip the BGA component on the flux prior to placement. Once it is dipped, the alignment and placement is done. As for the profile, I believe I am hitting the corr
Electronics Forum | Thu Oct 30 21:55:27 EST 2003 | johnwnz
Now I've checked the archives on this and found the starts of an answer but not much else, but then that posting was a while ago and I though there would be some more data now. So here's the question: who, if anyone is placeign Pb-free BGA's (ideally
Electronics Forum | Fri Feb 18 15:27:38 EST 2005 | jluckenbaugh
Frank R, I believe the Dymax #984-LVUF is a POLYURETHANE RESIN. I have used Humiseal 1A27 and 1A33 for several years with great success. Both of these materials are High VOC materials. If your customer does not require these materials to be aproved
Electronics Forum | Thu Jul 12 21:41:35 EDT 2001 | mugen
A) Questions: 1) What sort of pallet materials used? 2) what PCB thickness & LxW size? 3) what stencil type & thickness used? 4) what profile type used (peak deg-C)? 5) any peak Deg-C contraints for the components SMT onto the PCB? B) We use pallet
Electronics Forum | Tue Dec 16 06:42:51 EST 2003 | Kev
I am having problems achieving correct pre-heater temperatures with our Hollis solder wave. Our original "Verification Golden board" program uses a conveyor speed of 5ft per minute and pre-heat temps of 300, 350, 400 respectively. Our "golden Board"
Electronics Forum | Tue Nov 28 13:21:33 EST 2000 | Graham Naisbitt
Terry The SCC3 product is a vinyl modified silicone. It is less able to perform at low temps as it becomes brittle. It is not easy to repair because it is essentially silicone. It is not a qualified material to the MIL-I-46058 Spec. Are you sure yo
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