Electronics Forum: 2

Pick N Place UPS

Electronics Forum | Mon Aug 09 15:30:55 EDT 1999 | Dewey

Greetings, Would like to buy a 3 phase UPS for our Mydata TP11. Been looking and generally, sales person's point of view, 10KVA @ $10,000.00 is what they recommend. Seems a lot to me??? Called Mydata and suggested 2.2KVA per phase. I would purchase

preheater calibration

Electronics Forum | Mon Oct 14 15:48:37 EDT 2002 | pjc

If you are concerned with the actual temp of your pre-heater verses what the machine's display "says" the temp is, use a calibrated digital thermometer and place the thermocouple probe inside the pre-heater and next to the machine's thermocouple for

Fine pitch paste release problems.

Electronics Forum | Thu Dec 19 13:10:49 EST 2002 | gramsey

Really? Where does it say that? I have had the opposite experience and 3.2.2 from the IPC-7525 states for square or rectangular apertures - "Having a radiused corner for all apertures can promote stencil cleaning". It actually recommends circular ape

TOMBSTONE DEFECTS

Electronics Forum | Fri Mar 14 04:42:24 EST 2003 | emeto

Hi, About Thombstone defects: 1.Placement accuracy-main reason 2.Soldering-should be right on pads.The print should have regular shape.The quontity of the solder on both pads on one component have to be equal. 3.Reflow: the profile have to be made v

siplace part missing

Electronics Forum | Mon Dec 15 22:05:02 EST 2003 | Sam

hi Liang, We had the same problem like you before, it happened during starts up the machine (S13) and run the production for the first or second board. We also replaced the 2/2-way microvalve of placement circuit. The problem had solved at the begini

Mydata Hard Disk Failure

Electronics Forum | Wed Aug 18 06:20:42 EDT 2004 | Bernard Mulcahy

Thanks for the Feedback -- Yes the hard-disks is taking a dump -- This will be the fourth new hard drive since I did the upgrade from Tpsys 1.6 to Tpsys 2.2 Mydata can't really come up with a reason --I can't believe that I am just being 'unlucky' g

CCGA

Electronics Forum | Mon Apr 11 15:37:29 EDT 2005 | GS

For 1,27 mm Column Pitch, we set our process like this: - Stencil 0,20 mm If allowed also for other SMDs otherways some time 0,150 with step up stencil used only for CCGA area. - paste height min 0,175 mm - aperture 0,75 to 0,8 mm - paste volum

Pin-in-Paste, Intrusive Reflow, Solder Preforms, etc.

Electronics Forum | Mon Dec 04 12:32:45 EST 2006 | russ

Made no changes to pip process for lead free. Everything stayed the same. just have to ensure that components can withstand the high reflow temp. incomplete hole fill is from aperture not being big enough. Many people forget that paste reduces in

J-STD-001 Par 4.2.2 Temperature and Humidity

Electronics Forum | Wed Jul 18 10:35:41 EDT 2007 | hussman

This seems like an odd request from an auditor. I can see an auditor requiring proof that you meet the J-Std, but verify? This would require you purposely damage product on a "before and after" scenario. As long as your manufacturing guideline say

Solder Fillet

Electronics Forum | Tue Jul 01 17:15:03 EDT 2008 | ronhodgson

I would like an interpretation of a solder fillet on a 5 side termination cap. (Ref: IPC-610, sec. 8.2.2.6). My question pertains to the definition of dimension F, and what constitutes the top of the fillet. Does the top of the fillet end at where


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