Electronics Forum | Tue Jul 08 06:00:29 EDT 2003 | iman
As part of our process/quality improvement review, it was raised thru' our findings that its a good mfg practice to monitor the incoming solder paste quality (as part of the indirect materials). We get one-page "outgoing QC" vendor reports with each
Electronics Forum | Thu Oct 02 21:00:26 EDT 2003 | davef
Who says the chlorine comes from your tap water? Our PTOW dumps boat loads of chlorine into our water periodically. Sometimes it's so bad you can smell it. We doubt that it is the source of your problem. This chlorine will volitize very quickly,
Electronics Forum | Sat Jul 26 12:04:32 EDT 2008 | davef
Services, Recycling, Electronic boards * American Scrapmetal; 7120 Rufe Snow Dr, Suite 106-184, Fort Worth, Tx 76148; 817-891-5297 americanscrapmetal@hotmail.com http://www.americanscrapmetal.com * Clean Harbors, Inc; 1501 Washington St, PO Box 8590
Electronics Forum | Fri May 29 08:25:13 EDT 2009 | floydf
We are getting what looks like cold solder joints on one of our boards. The boards have an aluminum substrate, and use OSP plating. The solder is lead free - 96.5 Sn, 3.0 Ag, .5 Cu. The flux is no clean. When we first had the problem, my solder profi
Electronics Forum | Mon Feb 20 23:01:05 EST 2012 | davef
Services, Recycling, Electronic boards * American Scrapmetal; 7120 Rufe Snow Dr, Suite 106-184, Fort Worth, Tx 76148; 817-891-5297 americanscrapmetal@hotmail.com http://www.americanscrapmetal.com * Clean Harbors, Inc; 1501 Washington St, PO Box 8590
Electronics Forum | Mon Jul 24 20:39:49 EDT 2017 | dawson
We got an inquiry from US that requires high > volume 8 layer 1.0mm PCB, OSP + selective ENIG > surface, 5 groups impedance control, and stacked > vias. These requirements are common, but there is > 2/2mil lines in inner layers. It's said that th
Electronics Forum | Thu Dec 26 17:13:43 EST 2019 | rgduval
Doesn't really look like no-clean to me...typically, no-clean encapsulates the solder joint after reflow, trapping any organics. This looks like plain-old water soluble flux, that cooked a bit too much in reflow. As you noted, it cleaned up with
Electronics Forum | Wed Mar 13 09:08:40 EST 2002 | stockley
It is a little bit sad that I know this - be prepared for some confusision - this is not as simple as it might seem. Something tells me that the calculation of the tolerances for the nominal dimensions is a little inconsistent. As I recall the defa
Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef
By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11
Electronics Forum | Tue Jun 08 12:49:41 EDT 1999 | Dave F
| Hi,my master | How to iron out such soldering bridge with below conditions: | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | 3.using spraying fluxer and n
