Electronics Forum | Wed May 29 15:44:59 EDT 2002 | Jacob Lacourse
Hi, All Our board design requires us to selectively plate some connector pads with gold. The problem is we have changed board houses and they charge a heafty amount to mask the rest of the board. One option is to allow them to plate the whole bo
Electronics Forum | Wed Jun 26 12:21:30 EDT 2002 | dason_c
You can check with Alpha. ie Alpha had 3 different grade of the 63/37 bar, Vaculoy, Vaculoy SMG and HiFlo. You can consult with them and see which one fit for your current supplier. http://www.alphametals.com/products/solder_barwire/index.html Go
Electronics Forum | Tue Oct 22 17:23:35 EDT 2002 | Yannick
Hi, I wondering if someone know the anwser to that. I'm using a solder paste 63/37 and on the solder joint we have a tiny little layer or flux who is like crystalin. I try to play with my profile the get it off but I don't get much success. So D
Electronics Forum | Tue Jan 21 11:03:15 EST 2003 | MA/NY DDave
Hi You already received good answers. A thing to remember is the components and the PCB. How high you go above 63/37's 183C should be limited to create a good solder joint. Too long creates problems since the components and the PCB start to be he
Electronics Forum | Wed Jul 30 00:05:05 EDT 2003 | praveen
Hi, I am observing warpage in the PBGA during reflow in rework machine.Reflow profile is std. (Peak temp is 214 deg C using 63/37 paste). Please advise what should be the gap between the nozzle and the BGA body during reflow process in SRT BGA rework
Electronics Forum | Sat Sep 06 21:50:09 EDT 2003 | Hoss
Sr. Assuming you are processing the garden variety 63/37 paste on FR4 substrates, a good starting point is to plan for 3.5 to 4.5 minutes of process time on the board. If you measure the total heated length of your oven and you use the range above,
Electronics Forum | Tue Oct 14 23:30:38 EDT 2003 | Dean
Get high magnifiction micro structure analysis of the failed joints. I bet you will see the correct grain structure. What about the other part types? Any failures? I assume this is standard 63/37 Eutectic solder? These aren't heart monitors or
Electronics Forum | Fri Nov 21 14:15:09 EST 2003 | russ
If you use regular solder paste you will not need to process at the higher temp. Using Flux only will require you to reflow the lead free balls. When we process ceramic BGAs with the high temp/lead free balls we always use 63/37 paste and it works
Electronics Forum | Fri Jan 02 14:04:56 EST 2004 | jjwhite
Has anyone had any experience with 60/40 Sn/Ni(300 u in.) over Ni(300 u in.)? If so, what kind of solder issues might exist with 63/37 Sn/Pb reflow? Is a different paste needed? Also, what is the benefit of using the same platings with a top plating
Electronics Forum | Thu Apr 01 12:05:21 EST 2004 | babe
Heat guns scare me, hot air scares me too. Just the heck of it why not apply high temp paste to the center and eutectic 63/37 standard solder to the outside pads. The outside reflows first allowing proper seating of the component and with a proper pr
