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Full Site - : a4241 (Page 8 of 8)
Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission
SMTnet Express February 7 - 2013, Subscribers: 26168
SMTnet Express April 25 - 2013, Subscribers: 26322
IPC APEX EXPO 2011 Deals a Full House in Vegas
Apex 2011 - Don't miss these top exhibitors.
Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure
Positive Outlook from Exhibitors at IPC Midwest 2009
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IPC Certification Training from the comfort of your home or office. See our 2024 Training schedule now.
TIM & Thermal Gap Filler Dispensing - Download our new guide for process considerations and popular configurations.
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[3/19] Robust Reliability Testing For Drop-on-Demand Jet Printing
[3/12] Filling of Microvias and Through Holes by Electrolytic Copper Plating – Current Status and Future Outlook
[2/27] Dispensing EMI Shielding Materials: An Alternative to Sputtering
[2/20] Coat-and-Print Patterning of Silver Nanowires for Flexible and Transparent Electronics
[2/13] Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
[2/06] Accurately Capturing System-Level Failure of Solder Joints
[1/30] Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum
[1/23] Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies
[1/16] Ultra-Thin Chips For High-Performance Flexible Electronics
[1/09] Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms
[1/02] Temperature Cycling and Fatigue in Electronics
[12/27] A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism
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