Electronics Forum | Tue Mar 09 17:52:05 EST 2004 | davef
Bryan: Comments are: * You're correct, solder paste formualtion is a major driver to voiding in BGA balls. * Voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temp
Electronics Forum | Mon Oct 05 16:05:40 EDT 2015 | cyber_wolf
Washing no-clean solder residue out from under BGA's might present a challenge.
Electronics Forum | Thu Jul 10 22:46:08 EDT 2008 | davef
We'd like to see pads on the board that closely resemble those on the interposer.
Electronics Forum | Tue May 04 14:27:32 EDT 2004 | michasm2
Both are acceptable methods. - Printing on the board may give your operators a better ability to catch insufficient solder due to poor release; however if done right, printing directly onto the BGA ball is much more efficient and eliminates any compo
Electronics Forum | Mon Jun 21 18:33:46 EDT 1999 | Deon Nungaray
| We have a need to add a trace to a large quantity of bare PB's. The trace goes from a 25 mil QFP pad to a via. The rework must be done before we process the board. The rework cannot interfere with the solder paste screening process. | | Does a
Electronics Forum | Tue Jun 22 10:05:33 EDT 1999 | Chrys Shea
| | We have a need to add a trace to a large quantity of bare PB's. The trace goes from a 25 mil QFP pad to a via. The rework must be done before we process the board. The rework cannot interfere with the solder paste screening process. | | | |
Electronics Forum | Tue Jun 22 12:22:34 EDT 1999 | David Spilker
| We have a need to add a trace to a large quantity of bare PB's. The trace goes from a 25 mil QFP pad to a via. The rework must be done before we process the board. The rework cannot interfere with the solder paste screening process. | | Does a
Electronics Forum | Thu Jun 02 09:33:50 EDT 2016 | emeto
Hi, if I were you, I would probably go for testing and rework equipment. Adding manufacturing to your business, will most probably exceed your preliminary expectations. Manufacturing is much more complicated than you probably think. I have used manu
Electronics Forum | Tue Mar 01 15:13:22 EST 2011 | felixgutierrez
Hi Everyone. I would like your input in regards to lead free solder paste lead free. Which one is the most reliable solder for BGA's and BTC's (QFN). I have used different type of solder and on some of them i get big voids on BTC's and other one i g
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