Electronics Forum | Thu Jun 06 02:27:43 EDT 2002 | ianchan
Hi mates, does anyone know if there is a industrial standard spec for environment(deg-C, RH%) operational use of Paste Printer machines? If there is no study to define a deg-C, RH% specs for immediate environemnt operation use of a paste printer ma
Electronics Forum | Thu Apr 10 10:12:33 EDT 2003 | Claude_Couture
Chrissie, You have my deepest sympathies! But I'm very curious about your business takling a space contract. The quantity of boards that you mentioned hints at a GPS satellite systems, am I correct? In any space quality manufacturing, every step of
Electronics Forum | Wed Apr 30 03:44:45 EDT 2003 | chrissieneale
Lwei, Our boards are double sided and have BGA's on one side. We always run this side first so we can x-ray inspect the BGA's for short circuits, then run the second side. Depending on what industry you are in you may have some problems.. we work in
Electronics Forum | Tue Apr 13 21:33:48 EDT 2004 | qualitel
Hi Dreamsniper, It seen this is the major issue had been occurs you.( We had face all this issue last time too) We had done a lot of areospace products before and most of ours products is a must on class 3 spec. BGA is not that tough t
Electronics Forum | Thu Sep 23 23:42:52 EDT 2004 | KEN
The LF pastes will have virtually NO wetting spread. This is normal. LF mobilities are virtually non-existant with SAC alloys. However, the addition of varrying amounts of silver can (and does) improve mobility but, this comes with a price (paste
Electronics Forum | Wed Nov 03 09:18:27 EST 2004 | Simon UK
Hi Dennis, It is all dependant on what you state for the class of product i.e. Class 3 is the top end acceptance criteria used mainly in Aerospace and Military. You have 2 terms you need to grasp to avoid confusion. 1. Acceptance Criteria 2. Target
Electronics Forum | Fri Mar 18 14:21:02 EST 2005 | Dreamsniper
We are producing control products for the Aerospace Industry both Commercial and Military. I have TQFP 100 fine Pitch in one of my PWB's Solder Side and have no misalignment problems or defects on my part after 2nd reflow. I control my reflow profile
Electronics Forum | Wed Oct 19 07:44:33 EDT 2005 | davef
When a hole is drilled during board fabrication, it can transfer resin from the base material (eg, FR4 core or prepreg) to cover the exposed edge of conductive material in the wall of a drilled hole. This is called resin smear. Etchback is a control
Electronics Forum | Fri Apr 27 12:51:07 EDT 2007 | Machine Designer
The trade imballance isn't even being talked about in Washington. But still I can't see why on a global scale only China can compete when it comes to making goods. Speaking of Washington cleaning house in congress sounds like good idea but truthful
Electronics Forum | Tue Jan 15 15:53:14 EST 2008 | jmelson
I only build my own products, so it has to meet my needs for QA only. I am doing some 20 mil lead pitch (0.5mm) and will soon be doing a 0.4 mm pitch part. I have more magnification on my microscopes (40X) but almost never need to go that high. If
