Electronics Forum | Thu Dec 06 09:24:10 EST 2018 | ameenullakhan
Hi Rob, We used different Reflow Oven and noticed the component drop is less 1 out of 24 components. But not able to analyze, why its falling more in other reflow oven. Our maintenance team is assuring there is no vibration in any of the oven. And
Electronics Forum | Tue Feb 18 06:14:53 EST 2020 | astarotf
Evtimov SMTA-Alex Hi After the comments, we have analyzed our oven curve according to our sheet of technical data of solder paste. We modify the curve taking the linearity to the maximum with what the file specifies, we attach the profile and the c
Electronics Forum | Thu Jul 14 03:16:18 EDT 2022 | acouto
Thanks for the feedback, I've been having some problems with the motor overload in the conveyor and central reel whenever there is cleaning by the external company. After analyzing I always find talcum powder and lubricant (it looks like cement) on t
Electronics Forum | Thu May 30 10:06:20 EDT 2013 | rgduval
In general, it would not be advisable. DI water is used for a couple of reasons. First, the missing ions aid in the cleaning process, as they seek to bond with the material on the board, allowing the water to act like a fairly aggressive solvent.
Electronics Forum | Mon Jan 08 20:33:15 EST 2001 | Kyung Sam Park
Where can I find this kinds of S/W for SMT PROCESS. With defects collected for each smtline Analyze the cause of defect using D/B in smt process automatically(DB means cause of defects in smt process already prepared with for a long period ex
Electronics Forum | Tue Oct 17 18:10:05 EDT 2000 | Philip A. Reyes
Yes, you need to conduct X-ray inspection for BGA-SMT assembly, but it doesn't mean 100%. If your process is well capable and robust you can do sampling. There is an available X-ray machine that right now Iam assessing, cause we are going to buy one.
Electronics Forum | Fri Sep 15 05:48:24 EDT 2000 | carsonho
Have any experience that Sn/Pb plated integrated circuit products will appear some rainbowbridge-like substance after exposing at conditions of 121degC, 100%RH and 15psi for 48hours or above? The rainbow bridge substance was analyzed by EDAX and fou
Electronics Forum | Fri Sep 15 05:48:11 EDT 2000 | carsonho
Have any experience that Sn/Pb plated integrated circuit products will appear some rainbowbridge-like substance after exposing at conditions of 121degC, 100%RH and 15psi for 48hours or above? The rainbow bridge substance was analyzed by EDAX and fou
Electronics Forum | Fri Oct 29 02:07:48 EDT 1999 | Eom In Soub
hi. guys Have you out there ever seen the crack by means of humidity after reflow solering. We cannot analyze the cause of the tsop crack. The shape of crack seem to be hitted by sharp stuff. but there is no scar around crack . TSOP shaped long rec
Electronics Forum | Wed Oct 27 11:32:57 EDT 1999 | Brian W.
When I evaluated a new glue type, I simply used a shear force tester (Chatillon) to compare the cured strengths of the different glues. I sampled parts of different types; 0805, SOT23, 1206, and various tantalum caps. I analyzed the data based on e
