Electronics Forum | Wed May 02 11:22:19 EDT 2012 | aj
waste of time - get your materials manager to work on the smt floor for a week and see how ridiculous this approach is! saving pennies while adding time between setups, looking for parts and as you said issues with pickup etc....
Electronics Forum | Tue Dec 01 17:43:35 EST 2015 | barryg
Hi all, I was wondering if there are guidelines for how near components are to breakouts, and orientation of components near breakouts? Does IPC or other address this? We are sometimes approached with some crazy PCB layouts with multiple PCB's per ar
Electronics Forum | Wed Oct 26 09:50:27 EDT 2016 | schmidtv62
I'm looking for any information on the Samsung SM421 regarding BGA placement. We currently have a Universal GSM (circa 2004) GI-14 and we are approaching software limitations on multi-pitch BGAs. Any additional information about the SM421 capabilit
Electronics Forum | Fri Jan 27 17:36:40 EST 2017 | davef
Consider that printing may not be the only approach to getting paste on to your board. Would a dispenser work better?
Electronics Forum | Wed Mar 17 17:11:10 EDT 2021 | emeto
I would recommend flux approach. I have placed tons of these packages. They have plenty of paste on the balls, and tend to short easy when you screen paste. Even if you get the print right, you would still see more voiding compared to using just flux
Electronics Forum | Thu Sep 09 12:56:39 EDT 2021 | emeto
Thank you for your reply Djo. What do you consider a normal range tension for 29" stencil on a hard frame? Also I am not sure how I can use micrometer in the middle of 29" stencil to measure the thickness? CAn you please clarify?
Electronics Forum | Thu Sep 09 20:48:12 EDT 2021 | laserstencils
I do not know of a way to measure the nano-coating. However, it is easy to check if it is still on the stencil. Simply use a 'sharpe' pen and try and mark the bottom (PCB) side near any openings. If it easily marks, then the nano is no longer present