Electronics Forum | Thu Sep 06 22:49:35 EDT 2018 | cmchoue
Dear davef, All of this are takling about how to improve release solder paste, Area ratio, aspect ratio...etc, but i want to learn the "When design BGA stencil which the safe air gap between solder paste in difference stencil thickness", this can he
Electronics Forum | Tue Dec 17 20:25:13 EST 2002 | iman
Check : 1) design aspect ratio / are ratio required to fabricate the stencil you r using. 2) check if the stencil maker is using your checked aspect ratio / area ratio? if not the same, what are they using? any QA report confirming actual dimension
Electronics Forum | Tue Sep 21 13:12:56 EDT 1999 | Dave F
| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | Greg: I was going to link you to the IPC land pattern c
Electronics Forum | Tue Mar 21 02:15:26 EST 2006 | pavel_murtishev
Good morning Dave, Here are some of my assumptions. Please correct me if I am wrong. 1. Mask opening. Due to mask to PCB misregistration mask is not always centered relative to pad center how is should be. Sometimes edge of the mask matches with ed
Electronics Forum | Tue Oct 24 15:05:31 EDT 2000 | Steve Thomas
Maybe someone has a good explanation for this, but I'm wondering why your customer would dictate the equipment you use in your process. I thought typically contracts define the quality standards and you decide how to get there....show's you what I k
Electronics Forum | Fri Oct 27 11:34:30 EDT 2000 | Steve A
Wister, I agree with the other comments as far as challenging the customer, and minding proper height/width or better yet area aspect ratios. Let's assume you need to go with a .012" stencil for arguments sake. Talk to your stencil supplier about h
Electronics Forum | Sun Oct 08 00:18:05 EDT 2000 | Arturo
We are working with a 16mil TSOP Land width=0.2mm(8mil) and use: 1.Type 4 particle size solder paste. 2.Laser cut electropolished stencil: Aperture width=0.19mm (we tried lower than this but had solder insufficiency). Thickness=0.005"(130 microns)
Electronics Forum | Mon Jul 30 21:12:32 EDT 2001 | davef
"Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment: Stencil is too thick. Specifically, a 6 thou stencil should be OK, providing you don�t violate the area and aspect ratios in the fi
Electronics Forum | Thu Sep 30 06:47:51 EDT 1999 | park kyung sam
| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | we have placed 16 mil components for 3 years. why don't
Electronics Forum | Wed Feb 18 14:45:33 EST 2004 | Mauro Pinheiro
I'm looking for a shareware software that I could use for specifying stencils (we are stencil users not manufacturers). I would like to enter some preliminary spec in a software form, such as: the smallest pad geometry on pcb (possibly selected from