Electronics Forum | Fri Apr 06 08:27:09 EDT 2001 | CAL
From what you are saying................If I hear ya correctly - There is no "Proctective" on the Pads (OSP, HASL....) You will be hard pressed soldering to bare copper. This can not be right. My suggestion- go polyimide with electroptical connecti
Electronics Forum | Fri Apr 06 08:28:34 EDT 2001 | CAL
From what you are saying................If I hear ya correctly - There is no "Protective" on the Pads (OSP, HASL....) You will be hard pressed soldering to bare copper. This can not be right. My suggestion- go polyamide with electroptical connectio
Electronics Forum | Mon Dec 08 16:10:02 EST 1997 | Donnacha Nagle
Q1. As part of a Final Year Thesis I am currently undergoing an in-deph study of the Screenprinting process for MPM 3000 Screenprinters. Ultimately I will be setting up control charts on line. Does anybody have suggestions in this area ?, I have alot
Electronics Forum | Mon Oct 29 18:21:43 EST 2001 | slthomas
We recently have received a lot of warped (bowed and/or twisted behond IPC 600 specs.) bare boards (some our fabricator's fault, some ours by design) and I can't help but figure that long term reliability will suffer when building product with them.
Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef
Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1
Electronics Forum | Tue Aug 13 01:53:19 EDT 2002 | kenbliss
Hey Tony Although clearly everyone so far on this forum agrees that there is no real number in real life and virtual life is well....useless. The reality is that what you are really after is maximizing uptime, meaning, look closely at every event t
Electronics Forum | Thu Sep 16 21:11:10 EDT 2004 | davef
Left to its own devices the plastic used to seal your parts will take-on moisture in the air. When you heat there parts the water in the part expands and can damage the part, if not properly demoisturized. The instustry standards for controlling su
Electronics Forum | Mon Mar 30 13:14:41 EDT 2020 | dwl
Heat above 53 Celsius kills covid viruses according to the WHO: https://www.who.int/csr/sars/survival_2003_05_04/en/ If you want an added measure of safety, you could bake your boards before packing them. Fundamentally its going to be an issue of
Electronics Forum | Tue Apr 11 16:42:56 EDT 2000 | Chad Notebaert
I�m thinking �Poor intermatallic� It could be a few things. Lets start at the beginning. -Is your paste a 63/37 mixture? -Have you monitored you screen printing, Verify Solder deposition, Are you getting enough paste? -You say the solder looks like i
Electronics Forum | Fri Oct 22 11:53:53 EDT 2004 | C Lampron
Hi Christina, What would you be basing the yields off of? Is it solder defect, component placement, etc....? I have worked for a flex house for quite a few years. You are right. The Polyimide is very dimentionally unstable. (even more so on humid da