Electronics Forum: bare and baking (Page 8 of 20)

Solder Ball and Splash after Hand Soldering

Electronics Forum | Fri Jul 24 07:43:56 EDT 2009 | davef

Your customer is correct. You are doing something wrong in your hand soldering process. Solder balls are a process indicator. Areas to assess are: * Moisture content of the bare board * Thickness of the copper plating in the through holes * Temperatu

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Mon Feb 01 10:06:51 EST 1999 | Chris Fontaine

All of our moisture sensitive components are shipped to us in vacuum sealed, desiccated bags with a moisture indicator. When the parts are removed from the bag (this is done at either SMT setup, or in the stockroom) the indicator is checked. If it

Board change and solder not adhereing completely

Electronics Forum | Fri Apr 06 08:27:09 EDT 2001 | CAL

From what you are saying................If I hear ya correctly - There is no "Proctective" on the Pads (OSP, HASL....) You will be hard pressed soldering to bare copper. This can not be right. My suggestion- go polyimide with electroptical connecti

Board change and solder not adhereing completely

Electronics Forum | Fri Apr 06 08:28:34 EDT 2001 | CAL

From what you are saying................If I hear ya correctly - There is no "Protective" on the Pads (OSP, HASL....) You will be hard pressed soldering to bare copper. This can not be right. My suggestion- go polyamide with electroptical connectio

Screenprint Characterisation and PCB landscape analysis.

Electronics Forum | Mon Dec 08 16:10:02 EST 1997 | Donnacha Nagle

Q1. As part of a Final Year Thesis I am currently undergoing an in-deph study of the Screenprinting process for MPM 3000 Screenprinters. Ultimately I will be setting up control charts on line. Does anybody have suggestions in this area ?, I have alot

warped boards and cracked solder joints

Electronics Forum | Mon Oct 29 18:21:43 EST 2001 | slthomas

We recently have received a lot of warped (bowed and/or twisted behond IPC 600 specs.) bare boards (some our fabricator's fault, some ours by design) and I can't help but figure that long term reliability will suffer when building product with them.

force between the pad and laminate material

Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef

Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1

Fuji cp3 and ip2 placement speed

Electronics Forum | Tue Aug 13 01:53:19 EDT 2002 | kenbliss

Hey Tony Although clearly everyone so far on this forum agrees that there is no real number in real life and virtual life is well....useless. The reality is that what you are really after is maximizing uptime, meaning, look closely at every event t

Wash and bake of blank PCB's before assembly

Electronics Forum | Thu Jun 04 14:30:13 EDT 1998 | Igmar

I would appreciate any information concerning the wash and bake of blank Printed Circuit Boards before assembly. + Is it necessary to wash and bake PCB�s before assembly? + If any, what is the reason for wash and bake of PCB�s? + If any, what type of

Wash and bake of blank PCB's before assembly

Electronics Forum | Thu Feb 12 16:50:40 EST 1998 | Igmar

I would appreciate any information concerning the wash and bake of blank Printed Circuit Boards before assembly. + Is it necessary to wash and bake PCB�s before assembly? + If any, what is the reason for wash and bake of PCB�s? + If any, what type of


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