Electronics Forum | Fri Jul 24 07:43:56 EDT 2009 | davef
Your customer is correct. You are doing something wrong in your hand soldering process. Solder balls are a process indicator. Areas to assess are: * Moisture content of the bare board * Thickness of the copper plating in the through holes * Temperatu
Electronics Forum | Mon Feb 01 10:06:51 EST 1999 | Chris Fontaine
All of our moisture sensitive components are shipped to us in vacuum sealed, desiccated bags with a moisture indicator. When the parts are removed from the bag (this is done at either SMT setup, or in the stockroom) the indicator is checked. If it
Electronics Forum | Fri Apr 06 08:27:09 EDT 2001 | CAL
From what you are saying................If I hear ya correctly - There is no "Proctective" on the Pads (OSP, HASL....) You will be hard pressed soldering to bare copper. This can not be right. My suggestion- go polyimide with electroptical connecti
Electronics Forum | Fri Apr 06 08:28:34 EDT 2001 | CAL
From what you are saying................If I hear ya correctly - There is no "Protective" on the Pads (OSP, HASL....) You will be hard pressed soldering to bare copper. This can not be right. My suggestion- go polyamide with electroptical connectio
Electronics Forum | Mon Dec 08 16:10:02 EST 1997 | Donnacha Nagle
Q1. As part of a Final Year Thesis I am currently undergoing an in-deph study of the Screenprinting process for MPM 3000 Screenprinters. Ultimately I will be setting up control charts on line. Does anybody have suggestions in this area ?, I have alot
Electronics Forum | Mon Oct 29 18:21:43 EST 2001 | slthomas
We recently have received a lot of warped (bowed and/or twisted behond IPC 600 specs.) bare boards (some our fabricator's fault, some ours by design) and I can't help but figure that long term reliability will suffer when building product with them.
Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef
Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1
Electronics Forum | Tue Aug 13 01:53:19 EDT 2002 | kenbliss
Hey Tony Although clearly everyone so far on this forum agrees that there is no real number in real life and virtual life is well....useless. The reality is that what you are really after is maximizing uptime, meaning, look closely at every event t
Electronics Forum | Thu Jun 04 14:30:13 EDT 1998 | Igmar
I would appreciate any information concerning the wash and bake of blank Printed Circuit Boards before assembly. + Is it necessary to wash and bake PCB�s before assembly? + If any, what is the reason for wash and bake of PCB�s? + If any, what type of
Electronics Forum | Thu Feb 12 16:50:40 EST 1998 | Igmar
I would appreciate any information concerning the wash and bake of blank Printed Circuit Boards before assembly. + Is it necessary to wash and bake PCB�s before assembly? + If any, what is the reason for wash and bake of PCB�s? + If any, what type of
