Electronics Forum | Thu May 22 15:13:34 EDT 2008 | realchunks
I'm not b*tchy. You "guys" are too sensitive. I took my HR training and now know how fragile you "guys" all are. It's not your fault, it was my fault and I learned to deal with it. Go pop some popcorn.
Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman
Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also
Electronics Forum | Wed Feb 24 11:00:12 EST 1999 | Steve Schrader
Are the terms "uBGA" and "Fine Pitch BGA" synonomous, different all-together, or is Fine Pitch BGA a subset of uBGA? Thanks. Steve
Electronics Forum | Fri Aug 19 05:07:00 EDT 2011 | robertwillis
Its not a problem to do you just modify the procedure slightly for the smaller thinner parts. There some images and on my CD ROM and posters see http://www.packageonpackage.co.uk website I will also be doing a workshop at APEX and there is a webinar
Electronics Forum | Fri Jul 02 03:51:14 EDT 2004 | HARAN
I was told by my boss that the new product will be transfered to my facility will have the Super BGA and Hyper BGA.Can I know what is the difference of these 2 components compared to normal BGA.Is there any difference in the assembly process and requ
Electronics Forum | Mon Jul 15 17:35:42 EDT 2002 | davef
Micro BGA � (�BGA�). A Tessera brand name for a fine [0.5 mm and 0.75 mm solder ball] pitch BGA.
Electronics Forum | Fri Jul 02 08:24:16 EDT 2004 | davef
HyperBGA: http://www-306.ibm.com/chips/techlib/techlib.nsf/techdocs/852569B20050FF7785256996004C8AFA/$file/hyperbga.pdf SuperBGA: http://www.amkor.com/Products/all_products/sbga.cfm
Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.
Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process
Electronics Forum | Tue Apr 11 10:30:46 EDT 2000 | Jeremy Smith
I am having a problem with some joints on a 100 pin pqfp and few different soics on one particular board. When viewed a 8x with a "Mantis" inspection scope the joints look as though they wetted to the ic leg but when probed the leg will pop loose.
Electronics Forum | Fri Jul 12 12:52:14 EDT 2002 | pjc
I believe its called a BGA Clamp.
