Electronics Forum: bga balls move ceramic (Page 8 of 12)

Re: IP1 for Placement of BGA's?

Electronics Forum | Sun May 30 15:11:10 EDT 1999 | M Cox

| | | | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but accordin

QFP Coplanarity & Alloy 42

Electronics Forum | Tue Sep 30 21:00:41 EDT 2003 | davef

We're not clear on what you seek. So, as a starting point for our discussion, we wouldn't get agitated if we saw "routine" coplanarity of 4 thou. For instance: Maximum Lead Coplanarity [Altera] Package||Acronym||Lead material||Finish||Maximum Lead

Re: Fuji IPII BGA

Electronics Forum | Fri Nov 26 03:29:00 EST 1999 | TIM GOODMAN

HI WELL WE HAVE PLACED BGA,S AT A COMPANY ON A TRIAL BASIS, THE ONLY PROBLEM IS THAT YOU USE A PART DATA WITH A SQUARE PART IE PART TYPE 2 WITH A VERY SMALL BODY TOL .THIS WORKS WELL ON LARGE BGA,S BUT PLEASE PRE ROTATE AND MOVE AS SLOW AS POSSIBLE.

BGA excursion placed by IP3

Electronics Forum | Tue Jul 02 08:59:14 EDT 2002 | jax

On an IP3, from what I remember, the BGA Part data is defined from center part moving out towards part edge. If your pick up point is a little off this problem can occur. Otherwise, Check your gain and offset settings. The machine is probably recogni

Re: BGA reflow profile

Electronics Forum | Tue Jul 28 02:13:57 EDT 1998 | Bob Willis

There is a procedure for profiling on my web site that may be of use to start with www.bobwillis.co.uk | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ======

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Tue May 17 08:00:26 EDT 2005 | Bob R.

We went through this with one PBGA supplier recently and they were able to get the problem under control by fixing some of their molding processes that were inducing residual stresses. You can really see it in a thermal moire where you measure warpa

Why is NC the prefer process for BGA mounting? why not WS?

Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef

1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use

Re: IR Versus Hot Air - Put-Up Your Dukes

Electronics Forum | Thu Sep 23 23:58:01 EDT 1999 | Earl Moon

| | Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shielding near-b

Re: IR Versus Hot Air - Put-Up Your Dukes

Electronics Forum | Mon Sep 27 12:19:19 EDT 1999 | John

| | | Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shielding near

Lead free BGA on a Leaded Process

Electronics Forum | Sun Dec 26 21:18:04 EST 2004 | tellinghuisen

Chris, We also do not allow the use of Lead-Free BGAs in a lead based process. It is actually one of the things that scares us most about converting to Pb-free. Most of the suppliers that we have talked with are planning on moving to the SAC


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