Electronics Forum | Wed Aug 11 07:20:33 EDT 2004 | gregoryyork
HASL Fluids are generally not RA based fluxes. They are generally fluxes based on hydrochloric acid or hydrobromic acid or a mixture of the two, plus some very strong wetting agents that are very hygroscopic. Doesn't the residue of hydrochloric go wh
Electronics Forum | Tue Jan 06 16:31:41 EST 2015 | jacklucas
In switching to lead free processing, we find ourselves having over 400 PCB part numbers with Sn63 HASL finish. And there is no hope of quickly purging inventory and getting our drawings changed to call out a lead free finish. I want to avoid having
Electronics Forum | Mon Apr 26 12:03:22 EDT 1999 | Justin Medernach
| Help Guys!! | | We sub con assemble small to medium batch runs of mixed tech boards inc fine pitch BGA o4o2 etc. | | As usual we get all the crap to build that no-one else wants, however lately some customers are getting a little more serious wit
Electronics Forum | Tue Aug 15 16:57:54 EDT 2000 | Doug Philbrick
In many threads here I have read and talked about Electroless Gold problems and have experienced my own problems with it. Love to hear what others are doing as a replacement. Is it Electroless tin, is it osp or is HASL good enough for .031 pitch BGA
Electronics Forum | Thu Oct 14 17:14:39 EDT 2004 | mattkehoe
We are experiencing a problem with soldermask defined BGA pads not accepting solder during the reflow process. The paste is there when the boards come off the printer but after reflow, no paste. Some other pads in the same pattern are fine. Here is t
Electronics Forum | Tue Sep 14 14:22:11 EDT 2010 | grahamcooper22
If the HASL was poor quality and very thin you would find this defect....but you would expect to see it on more pads also. Also, you'd expect to see your solder from your solder paste either dewetted on the pad or reflowed onto the BGA sphere making
Electronics Forum | Fri Jun 18 13:47:33 EDT 1999 | Jason Gregory
| Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave review
Electronics Forum | Tue Apr 13 22:48:11 EDT 2004 | Ken
I assumed the balls were tin/silver 221C or tin/silver/copper 218C liquiduous....but, this is obviously not the case. It looks like you balls are almost pure tin (mp=238C) You are correct. This is exactly the same as using 10/90 high temp balls o
Electronics Forum | Sat Sep 20 11:44:39 EDT 2003 | Gabriele
Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - PCB copper finisch ? (OSP,HASL, ENIG, etc) - v
Electronics Forum | Fri Feb 01 05:18:59 EST 2013 | eniac
If you have a hard-gold on your pads, it's not a problem. Hard gold can give to you 4 or 5 times for PCB soldering (BGA repair). Soft gold (or flash-gold) can destruct, after that will start a migration of nickel up through gold, your pads will be