Electronics Forum: bga on bottom side (Page 8 of 34)

Question on Thermal Overstress on BGA Balls During Rework

Electronics Forum | Fri Mar 17 16:58:52 EST 2006 | mikecollier

We are currently struggling with a particularly difficult component selection form our designers. This is a custom BGA, 592 balls, metal cover with a very large bead of adhesive using to retain the cover. We have had significant fallout (greater th

void on BGA Ball due to via on BGA pad

Electronics Forum | Fri Aug 16 10:00:03 EDT 2002 | davef

You have a very bad situation. It�s tough for the gas, flux material, er whatever to escape when the BGA is sitting on top of it and the blind via is blocking it from the other side. Obviously the vias should have been: * Placed on the edge of the

Soldering on a Ground Plane

Electronics Forum | Thu Feb 10 09:08:21 EST 2000 | C.K.

We've got this hard-to-Wave-solder board where all of the SMD's are on a ground plane - in fact the entire bottom-side is a ground plane. Our designers have incorporated thermal relief on some of the pads, but for reasons unknown to us, they don't h

Re: Excess solder on pins

Electronics Forum | Tue Jul 14 15:21:28 EDT 1998 | Brian Conner

| We are wave soldering a board having 24 similar thru hole connectors on it, using a wave soldering pallet. The problem is that one particular pin of connector in around 6-9 connectors get excess solder on the bottom side. I have tried all the par

Re: Excess solder on pins

Electronics Forum | Fri Jul 10 13:58:49 EDT 1998 | Bob Willis

The parameters which effect the problem you are having are flux and contact time try first increasing the flux you are applying. Next reduce the contact time in the wave by adjusting the back flow plate. If the problem is a jig design check out the j

Re: Excess solder on pins

Electronics Forum | Wed Jul 15 15:18:12 EDT 1998 | Upinder Singh

| | We are wave soldering a board having 24 similar thru hole connectors on it, using a wave soldering pallet. The problem is that one particular pin of connector in around 6-9 connectors get excess solder on the bottom side. I have tried all the p

Re: Tin-Lead thickness on PWB's

Electronics Forum | Thu May 21 09:54:07 EDT 1998 | Justin Medernach

| I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and solde

BGA on both Top and Bottom

Electronics Forum | Wed Jul 13 16:51:28 EDT 2005 | KT

we do it all the time. We havent had any problems with the BGA's. But, you dont want BGA right beneath another BGA.

Re: SPC on stencil printer

Electronics Forum | Wed Jan 13 20:44:42 EST 1999 | Steve Gregory

Hello Sanjay! The cheap deal I use that Earl spoke of is called a SMarT Measure. It's a depth measuring microscope that uses the same principle of measuring optical focus that the units from Vision Engineering do ( if you've ever looked at any

Re: SPC on stencil printer

Electronics Forum | Thu Jan 14 11:08:29 EST 1999 | Mike McMonagle

Steve, Whoa, take a breath! That was at least a dollar three-eighty answer. I've got to agree that nothing can replace a qualified, concientious operator for assuring quality. When I too worked at a small shop there in SillyCone Valley, my seni


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