Electronics Forum | Tue May 01 06:54:22 EDT 2007 | LC
Hi, We are encountering BGA problems where it dislodge from the board. Some are just by normal handling and some are results from drop test about 15 cm high. We have checked our profile and they are in accordance to the BGA recommended reflow profil
Electronics Forum | Fri Jul 21 16:47:17 EDT 2006 | stepheniii
Does replacing the BGA fix the problem? To be a little more blunt, is the BGA or is it the tech says it's the BGA. Beleive none of what you hear and only half of what you see. What kind of BGA is it? If it is one of those BGA's with a built in heats
Electronics Forum | Thu Nov 02 22:11:46 EST 2000 | Dason C
Please check with Fab house, what is the thickness of the immersion gold if the gold thicknesss is less than say 2.5 micron, you will found dewetting or open. It is recommend the gold thickness is around 5 micron. Good Luck Dason
Electronics Forum | Mon Mar 27 08:28:48 EST 2000 | Mark Alder
Dear Robert The reason for the bridging problem you are experiencing on your BGA's is due because of too much solder. The PCB pads need to be at least 15% larger than the sphere size of the BGA balls. If you are not using C4 (63/37) BGA spheres and
Electronics Forum | Sun May 08 07:09:04 EDT 2005 | Rick Iodice
We are continuing to struggle with voids under BGA's. Our problem are not consistent. some CCA's are perfect but others have pin hole sized voids. Does anyone have any feedback on Indium 92j and how it performs for bga's?
Electronics Forum | Tue Jan 30 02:38:50 EST 2001 | arul2000
This BGA could have gone through the reflow cycle two times as we understand from the BGA manufacturer, during the BGA ball attachment process. (If any ball is found missing, they replace the missed ball manually after applying flux manually and refl
Electronics Forum | Sun Mar 07 19:58:03 EST 2004 | praveen
Hello , Can any body help in solving the problem of PCB warpage during BGA rework. I am using IR heating system. No problem found in reworking BGA's size less than 30mmx30mm but for 35 mmx35mm and above BGA get solder short due to PCB warpage. Note
Electronics Forum | Tue Jan 30 02:29:16 EST 2001 | arul2000
Dave, To do further analysis we don't have the BGAs of the batch from which we had this issue. We don't face this issue now in the current production lots. The problem got solved while trying to find the root cause. Will keep updated if it occurs ag
Electronics Forum | Fri Nov 25 09:31:56 EST 2005 | davef
pyramus, First, search the fine SMTnet Archives for previous discussions on BGA shorts. Second, we're still not clear on the issue. * Is the problem with a BGA? If so, please describe the BGA, including any heat spreader * Is the problem with a uB
Electronics Forum | Mon Feb 12 01:21:42 EST 2007 | Joe
yup, current SAC has a lot of problem with large BGA balls. Just like Wayne explained earlier.
