Electronics Forum | Wed Jun 14 11:32:44 EDT 2006 | muse95
There is an IPC test method involving a tape test, which you can try for a start. Look at the IPC TM-650 free on the IPC site. Black pad occurrences are much reduced, but I don't believe you can say they never happen, even to the better board houses
Electronics Forum | Wed Jun 14 20:49:32 EDT 2006 | davef
We too do not use ENIG. Too expensive and risky. Implementing a Simple Corrosion Test Method to Detect "Black Pad" Phenomenon in Electroless Nickel/Immersion Gold Plating ; BabHui Lee; Circuitree 11/1/03 http://www.circuitree.com/CDA/Archives/34f2b
Electronics Forum | Fri Jun 16 10:23:40 EDT 2006 | pms
Thanks Davef, We recommend ENIG to our customers at this time, we have not had any customers reporting issues with it so far. I like the protection of the nickle from copper dissolution during wave in a PB free scenerio, but the "Black-Pad" issue i
Electronics Forum | Thu Dec 21 22:17:42 EST 2006 | davef
Waving the board will sweap away the crud of black pad and to produce a solderable surface, but this surface may have too much solder and may not be very flat. This can create problems when printing paste and placing and soldering components, depend
Electronics Forum | Thu Jul 09 10:34:49 EDT 2009 | davef
We can't tell from your picture that you have black pad, but it's not uncommon. Look here: * http://findarticles.com/p/articles/mi_qa5348/is_200606/ai_n21392950/?tag=content;col1 * http://www.pwbrc.org/members/pdf/works99/Houghton.PDF
Electronics Forum | Fri Aug 19 01:56:53 EDT 2011 | ppcbs
I've been seeing a lot of product come in with what appears to be black pad lately. I've sent stuff out to labs to be told there is no contamination. Contamination or not solder won't wet to it. Regardless of what it is we have a method to remove
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Wed Mar 01 17:05:34 EST 2000 | Dave F
Glenn: I hear you, but when Steve talks about a "dark haze" and "scrap(ing) the �black stuff� off the pads" to make them solderable, but I don�t think of "black pad." I think of "black pad" as a surface coating that typically can not be removed by
Electronics Forum | Wed Mar 01 17:05:34 EST 2000 | Dave F
Glenn: I hear you, but when Steve talks about a "dark haze" and "scrap(ing) the �black stuff� off the pads" to make them solderable, but I don�t think of "black pad." I think of "black pad" as a surface coating that typically can not be removed by
Electronics Forum | Fri Dec 29 16:05:56 EST 2000 | Dave F
I don't know how I ended-up reading a current trade journal, when I have a stack of intentions behind my desk a foot and a half tall, leaning like a paper Tower of Pisa threatening to avalanche itself onto the underfill materials study, a meager one
