Electronics Forum | Wed Oct 16 20:54:36 EDT 2002 | J
_a class=roll > href="http://www.semicycle.com/semicycle.htm" > target="_blank"_http://www.semicycle.com/semicycle > .htm_/a_ Funny thing, they never told us they > paid for them, just that they'd provide boxes and > pick them up. I wonder how
Electronics Forum | Fri Feb 28 09:52:47 EST 2003 | ksfacinelli
One easy and often over looked step is to call out IPC-6012A compliance on the PO. You will also need to call out the class status. If you get in an issue regarding quality you will have a resource to fall back on. Sounds simple but ask your buyers
Electronics Forum | Thu May 19 17:03:11 EDT 2005 | splice1
Hi all, There are no ground layers which makes the non wetting rate a bit confounding. The foam fluxer has not been cleaned in a while though, while there is a strong evidence of fluxing by running blank paper and looking up the top side
Electronics Forum | Wed Feb 21 21:01:57 EST 2007 | davef
Yes. Heat reduces OSP solderability protection thickness. For instance, many OSP are shot at the end of the first reflow pass and the exposed copper is free to oxidize. If you're speedy, you can pull-off the second reflow cycle before the copper g
Electronics Forum | Mon Mar 12 13:57:50 EDT 2007 | davef
That your problem is not related to component solderability or wave process related makes us believe this has to do with bare board design. Look at how your designer did the thermal relief on the two pins that don't solder well. If you can't get a
Electronics Forum | Thu Apr 16 09:54:12 EDT 2009 | davef
We know virtually nothing about your process, but here's some guesses: * Turn-off the nitrogen * Change from Sn63 to Sn62 * Change to a low-tombstone paste * Change the thermal recipe: slower ramp, longer soak * Do a better job of placing components
Electronics Forum | Sun Sep 27 17:31:12 EDT 2009 | bandjwet
There are a couple of companies that make BGA > reballing kits. Try: Winslow Automation _a > class=roll > href="http://www.winslowautomation.com" > target="_blank"_http://www.winslowautomation.com_ > /a_ Another alternative BGA reballing kit
Electronics Forum | Wed Jan 27 10:00:15 EST 2010 | stepheniii
And making a form with drawings of generic parts with blanks to fill in the data can help streamline the process as well. Has anyone met anyone who trusts datasheets more than the part itself? I always figured that the machine was verifying the par
Electronics Forum | Thu Jan 26 15:16:56 EST 2012 | raranchado
Anybody knows how to use TiMMS Traceability? We're not using the application anymore 'cause we replaced it but server still up for record retention. The engineer who managed this one already left the company and now customer asking for the records. I
Electronics Forum | Mon Apr 02 11:01:04 EDT 2012 | vparis
None of those p/ns are coming up good, maybe > they're obsolete. Try contacting Cardinal > Circuit, they have tons of older MPM parts, _a > class=roll > href="http://www.cardinalcircuit.com/spare-parts-s > upport/" > target="_blank"_http://www.