Electronics Forum | Fri Jul 28 06:16:20 EDT 2006 | pavel_murtishev
Good afternoon, We run mixed LF/SnPb process for most of out products. Most of chip passives have lead free termination and some of them tend towards blistering issue. SnPb solder wets component in very strange way. Wetting phenomena seems to be abn
Electronics Forum | Mon Jan 25 21:14:08 EST 1999 | Dave F
| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r
Electronics Forum | Tue Mar 30 20:04:19 EST 2004 | Ken
If speed is truly an issue, migrate to no-clean. However, this is not always an option. Why bake after 1st smt pass? Because you are probably not drying completely under the BGA components, and/or you are pushing water into the parts/boards/ vias
Electronics Forum | Thu Aug 25 10:17:48 EDT 2005 | davef
Send the pic to dave5252 at hotmail.com [you can't send pic through the SMTnet email thing] For more on via plugging, tenting, capping ... look here: http://www.merix.com/technology.php?section=processes&page=pdf/Via_Fill_Plug.pdf Something, a voi
Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
Electronics Forum | Thu Mar 12 03:14:14 EDT 2009 | nibirta
Thank you for support. As i promised you, I am coming back with the results. The SM used was Probimer 77 with Kester 979 flux. The supplier says that there is an incompatibility and we have changed the flux with IF2009M. Same problem! They have chan
Electronics Forum | Fri Aug 21 04:43:14 EDT 2009 | ghepo
Hello, I suggest you visit the website http://www.analysispcb.com, where I found these information : PARAMETERS FOR DOUBLE “V” SCORING LEAD FREE LAMINATES Typ WEB Thickness, 1.6mm : 0.38mm (+.15/-0) "...Tg is not a good indicator of a materials’
Electronics Forum | Wed Aug 21 09:09:50 EDT 2013 | wcheew
I am having solder barrel fill issues on THM component, we follow, we follow IPC 610 E requirement. The barrel fill issues happen on signal & ground pin at connector & E-cap. I found out that most of the insufficient solder happen on the connector ag
Electronics Forum | Sun Jun 22 13:24:49 EDT 2014 | davef
I don't know. We never had craziness like this before lead-free. You should have the yellowish-metal analyzed to be sure. Guessing: You're seeing this color on the terminations of components, not on the bulk of the SnX solder connection. If that's
Electronics Forum | Mon Sep 08 21:12:29 EDT 2014 | eurekadrytech
Hello, Manufacturing process with high moisture and humidity environments and long term storage will definitely see pop corning effects once high temperature from soldering and/or re-flow process. The moisture that has been adsorbed is likely the ro
