Electronics Forum | Mon Mar 26 16:58:53 EDT 2018 | solderingpro
Is there anything stopping you from replacing the flat belt solution to a continuous running steel roller chain conveyor? - From there (depending upon board temperature) you should be able to buffer your boards in a vertical buffer station if neede
Electronics Forum | Thu Mar 31 11:15:25 EDT 2022 | proceng1
So the NEW component is SOT-23? What is the foot print on the board?
Electronics Forum | Wed Aug 21 10:26:08 EDT 2002 | stownsend
We are using OSP coated boards and no-clean solder paste. In a few instances, we are seeing increased distortion in an audio circuit. Has anybody seen or heard of surface insulation resistance (SIR) decreasing after reflow on OSP boards? Is it possib
Electronics Forum | Tue Sep 09 18:07:18 EDT 2003 | davef
We would be very wary of allowing 50 uinches, because this will likely result in reduced shelf life due to intermetallic growth. As a guesstimate, at least 10 uinches of that 50 uinches, and maybe more, is already intermetallic when you receive the b
Electronics Forum | Fri Sep 12 09:10:23 EDT 2003 | Norm Morikawa
Around 1989 I had this probelmm with a SMT CCA that would not solder in one area consistently. I had it cross sectioned by the bare board supplier and found that under their metallurgical microscope the thickness of this HASL bare board could not be
Electronics Forum | Thu Jul 14 11:04:53 EDT 2005 | dougs
yes SPC can be used on a wave solder machine, you should use a c-chart to monitor the amount of defects per board or group of boards, this will let you know if your process is stable, as you improve your process you should re-calculate your UCL, hope
Electronics Forum | Mon Jun 26 08:54:35 EDT 2006 | dougs
We have a new product in where a 0.7mm pitch uBGA is to be placed on a 2 layer flexi board. Also a 20thou pitch connector. Has anyone done anything like this before, what should i look out for. Not done much flexi work before so any tips will be g
Electronics Forum | Sat Jul 29 09:10:16 EDT 2006 | davef
Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board placed in an array on the bottom of the package. They are attached to the board with tiny balls of solder placed on each contact. Pin Grid Array (P
Electronics Forum | Tue May 22 16:07:31 EDT 2007 | francitj
We are doing a field study to test the placement accuracy and calculate cpk of some machines in our plant. From previous readings, it is suggested that you buy glass board kits from Accuspec, Topline, etc. Is that the easiest/cheapest way to go abo
Electronics Forum | Thu Aug 23 16:28:14 EDT 2007 | grics
I want to get a collective opinion from the forum... I was always under the impression that Humidity at SMT can be a disaster and can cause solder balls... But what about at the Wave/Selective solder? If every board or almost every board has solder
