Electronics Forum | Tue Jul 18 11:50:26 EDT 2000 | Jeff Sanchez
Hey all, My brother is a tech at TI. He is running tests on bump dies. The question is if he heats up a die (actual waffer) with out disrupting the solder can he still use the solder. Will the solder lose its integrity? Keep in mind that these
Electronics Forum | Wed Jun 17 14:46:18 EDT 1998 | Robert Smith
1. I need to be able to probe into my product's substrate which has all components in die form. I would need to be able to bring out any pad information for hookup to a scope or any other external piece of equipment. I do not have the convenience o
Electronics Forum | Tue Sep 11 19:54:52 EDT 2001 | gsparka
HELLO. SMTNETERS there is no company in high mix low volume system in our contry so . what is the best way to calculate the capa. of smt line in high mix low volume. & what is the general way to get the defect rate to evaluate the smt line(or sm
Electronics Forum | Tue Jul 01 17:38:24 EDT 2003 | jartman
I've faced this several times in the past, and the only real solution is to wirebond before SMT assembly. Everything leaves a residue, and trying to clean a residue off later is basically hopeless. This may require some trickery in your SMT process
Electronics Forum | Thu Aug 03 12:51:20 EDT 2006 | Ofer Cohen
I'd appreciate your support in the following issue: A significant batch of PCBs failed on de-lamination. The failure was identified, of course, only after the assembly. There is a big variety of components (BGA 1mm, BGA 0.8 mm, FQPs and other SMT co
Electronics Forum | Thu Aug 03 12:51:59 EDT 2006 | Ofer Cohen
I'd appreciate advise in the following issue: A significant batch of PCBs failed on de-lamination. The failure was identified, of course, only after the assembly. There is a big variety of components (BGA 1mm, BGA 0.8 mm, FQPs and other SMT componen
Electronics Forum | Fri Sep 28 02:48:46 EDT 2018 | teresat2
Principle A layer of photosensitive material (photosensitive oil or dry film) is applied to the copper foil on the board surface, and PCB manufacturer should be use the position is exposed by black film, This applies to most PCB factories, especially
Electronics Forum | Fri Oct 25 13:23:02 EDT 2019 | SMTA-Joe
Hello SMTA, This may be beyond the scope of the SMTA since it does not strictly deal with assembly of electronics, rather, it is about potential solderless methods for manually tuning RF circuits. Our Engineers & QC have tasked manufacturing with
Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon
| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo
Electronics Forum | Mon Feb 15 15:33:47 EST 1999 | Earl Moon
| Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc | I'm sure you know all the basic differences as Tg, X, Y, and Z expansi
