Technical Library | 2004-05-23 17:18:26.0
This is an article written by our company's experts to help our customers to make informed decision on PC boards purchasing. It introduces the materials that are used in the PCB manufacturing and the cost analysis of different materials.
Technical Library | 2015-11-25 14:15:12.0
In this study various printed circuit board surface finishes were evaluated, including: organic solderability preservative (OSP), plasma finish (PF), immersion silver (IAg), electroless nickel / immersion silver (ENIS), electroless nickel / immersion gold hi-phosphorus (ENIG Hi-P), and electroless nickel / electroless palladium / immersion gold (ENEPIG). To verify the performance of PF as a post-treatment option, it was added to IAg, ENIG Hi-P, and ENEPIG to compare with non-treated. A total of nine groups of PCB were evaluated. Each group contains 30 boards, with the exception on ENIS where only 8 boards were available.
Technical Library | 2013-01-17 15:34:33.0
The use of an electroless nickel, immersion gold (ENIG) surface finish comes with the inherent potential risk of Black Pad failures that can cause fracture embrittlement at the interface between the solder and the metal pad. As yet, there is no conclusive agreed solution to effectively eliminate Black Pad failures. The case studies presented are intended to add to the understanding of the Black Pad failure mechanism and to identify both the plating and the subsequent assembly processes and conditions that can help to prevent the likelihood of Black Pad occurring.
Technical Library | 2016-07-07 15:37:18.0
How susceptible are the metals used in modern electronics manufacturing to corrosion by common beverages? This is a question of interest, especially to manufacturers, retailers and to a certain extent end customers. In this study the dissolution of aluminum, copper, gold, iron, lead, nickel, SAC305 solder, silver, tin and zinc was examined. Individual foils of these materials were fully immersed in one of sixteen chosen beverages and heated for 3 days at 40°C. The resulting solutions were analyzed using ICP-OES. The data were examined in light of the known pH, conductivity and ionic contents of the beverages, determined in previous work. Conclusions about the relative susceptibility to corrosion of the various metals and the corrosive power of the different beverages are made.
Complex functions are compressed on ever less room while simultaneously an enhancement in performance must be obtained. With coated Bonding pads in various designs Heraeus Materials Technology offers customer oriented solutions that aid the increas
Technical Library | 2013-08-29 19:52:43.0
Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...
Industry News | 2012-03-16 20:22:35.0
CyberOptics Corporation (Nasdaq: CYBE) will debut the QX100™
Industry News | 2018-06-04 18:18:26.0
StratEdge Corporation will feature its new line of packages that meet the extreme demands of gallium nitride (GaN) and gallium arsenide (GaAs) devices at the 2018 International Microwave Symposium. StratEdge packages meet the critical requirements of the telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole, and MEMS markets.
Industry News | 2017-04-07 15:01:40.0
Students, educators and institutes will get a discount on devices and accessories in the LCR-Reader Store. The discount will reflect the quantity purchased
Industry News | 2017-10-31 18:46:42.0
At this year’s Productronica event in Munich, Germany, ECD (Hall A4, Booth 532) will showcase its award-winning thermal profiling technologies, including the broad portfolio of M.O.L.E.® thermal profilers, wave soldering test pallets and reflow oven performance verification tools. In addition, the company plans to debut a next-generation, scalable monitoring system designed to provide continuous oversight and customizable data analysis for various SMT thermal processes. The first module centers on reflow oven performance and output optimization
