Electronics Forum | Tue Oct 11 18:52:19 EDT 2016 | davef
Reflow => Top side DIP => Bottom side glue => Bottom side SMT => Wave solder ... We couldn't keep the DIP clinch apparatus away from the bottom side SMT if we did the bottom side SMT prior to DIP.
Electronics Forum | Fri Dec 22 05:15:25 EST 2006 | josaf
Epoxy [ bottom side ] to Epoxy [ bottom ] ---> solder paste [ top side ]
Electronics Forum | Tue Jul 01 13:35:49 EDT 2008 | realchunks
QFNs have pads on the bottom. LCCs have pads on the sides that are exposed on the bottom.
Electronics Forum | Wed Mar 11 09:06:06 EDT 2009 | lococost
No, it's not. Bottom components will reflow regardless of bottom side heaters.
Electronics Forum | Mon Mar 22 19:46:17 EST 2004 | pdeuel
The bottom side is going into reflow somewhare near melting point of solder. Reduce bottom side temprature. Get a good mole so ramp and soak tempratures can be checked on bolth sides of the PCB. The object is to keep bottom side parts from approching
Electronics Forum | Wed Jan 18 02:00:36 EST 2006 | pavel_murtishev
Good morning, This isn�t very strange. Bottom side components are prone to tombstoning more than topside ones. Try to reduce oven�s bottom heaters temperature slightly to prevent solder paste melting on bottom side. This can help. BR, Pavel
Electronics Forum | Tue Dec 09 12:26:45 EST 2008 | greene08
I have virtualy no experience with placing bottom side components. We have a new board coming that will have a few R's & C's bottom side. Can anyone give oppinion on dispensing glue dots vs. applying adheasive with a stencil ? thanks
Electronics Forum | Mon Mar 12 13:56:06 EDT 2018 | proceng1
Oh I know it's BS. It's not like the mesh belt creates a barrier between top and bottom. There is very little delta from top to bottom. Whenever I see a recipe with different temps from top to bottom, I just delete it.
Electronics Forum | Wed Dec 11 07:58:38 EST 2019 | clockwatcher
Although this is not technically a bottom termination component, the method of attachment of the thermal pad is a bottom termination attachment. For bottom termination components IPC states that "thermal pad void criteria shall be established between
Electronics Forum | Wed May 06 13:10:56 EDT 1998 | ZULFIQAR H. RIZVI
Dear Freinds, DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOXY DISPEN
.gif)
