Electronics Forum | Thu Jul 27 13:59:04 EDT 2000 | Chrys Shea
Sounds like the problem is design realted - here's a cheesy trick if your product/process permits: (you know how I love my cheesey tricks!) Put an adhesive dot between the pins that are bridging. If you're gluing bottomside SMT components to the bo
Electronics Forum | Wed Aug 18 16:26:21 EDT 1999 | Tony
Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. This is what I did. Created a removal profile, I had a board
Electronics Forum | Fri Mar 28 14:52:36 EDT 2008 | shrek
KRIKIES, is this match.com?
Electronics Forum | Wed Oct 29 23:07:42 EDT 2014 | rajz
Help Needed. I face a solder bridging issue on solder mask define pad at edge only for nexlev connector . The pad design such as smd at four corner only. The bridging happen on signal to ground pin only. Current stencil we use 22 round with 6 mils s
Electronics Forum | Wed Dec 13 14:15:54 EST 2000 | Chris
I have a product where an IC is soldered using a stencil which puts down way too much paste. The result is massive bridging. Anyway, one of my coworkers claimed he could eliminate the bridging by baking the circuit board in an oven for 5 min at 90
Electronics Forum | Wed Sep 02 06:50:55 EDT 1998 | Masdi Muhammad
Hi, We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it. Than
Electronics Forum | Wed Nov 07 17:10:15 EST 2001 | davef
If you don�t paste / reflow solder on the pads, they will never bridge. ;-) A design with a 0.13mm gap between pads will challenge equipment, materials, and process.
Electronics Forum | Wed Nov 07 18:37:27 EST 2001 | steven
sometime hand solder can cause also. no necessary have to be paste n reflow.:) now i'm facing bridging on 0402 components pads. any suggestions on spacing distance as we're going to re-design the pcb.
