Electronics Forum | Thu Apr 08 10:54:16 EDT 2004 | mrmaint
We typically store the tubes straight up and down. This seemed to help with the air pocket problem. Did not solve it 100 percent. best bet is still vacum.
Electronics Forum | Wed Dec 08 11:29:48 EST 2004 | Marcus
Hi, champagne voiding is the term for small flux enclosures in a solder joint. Under X-ray that looks like the bubbles in a champangne glass. Marcus
Electronics Forum | Tue Nov 14 19:13:21 EST 2006 | russ
You have incomplete plating in the through holes would be my bet, baking will not solve, nothing will, at least that is what I have found except a lot of hand work and frustration, have your PCB house perform cross section at affected area in your
Electronics Forum | Mon Apr 02 10:48:18 EDT 2007 | chrissieneale
Change operator to OPERATORS (there's 3 per shift, 2 shifts) and then you can join me in confused bubble...
Electronics Forum | Mon Jun 25 12:23:15 EDT 2007 | coax
As for the bubbles/fisheyes, try increasing your thinner ratio. This sounds like your coating is thickening up before you are able to apply it to your application.
Electronics Forum | Thu Feb 21 16:57:02 EST 2008 | flipit
If the vias are large and don't always tent, you can have your pcb supplier double mask the pcb. I do this for COB assembly sometimes because the globtop wicks through the vias and also causes air bubbles in the globtop.
Electronics Forum | Fri Jan 16 10:54:21 EST 2009 | realchunks
Hi Steve, Make sure your spray head is all the way down. If so, try slowing your rate of speed over the part. Which head are you using to coat this part?
Electronics Forum | Mon Jan 19 09:10:17 EST 2009 | stevewilde
Thank you for all of the advice. I am using the extended spray for these cards. Humiseal have recommended using their own thinners 600 instead, so will run some trials with this and also the humiseal pre-mixed material (at the moment we mix our ow
Electronics Forum | Tue Feb 03 13:47:59 EST 2009 | grics
I would also suggest looking at your ramp rate in the cure oven. We noticed that accelerated heating increased the "gas out" of the solvent. We run 1A33 and and do not exceed a .5/degC ramp rate.
Electronics Forum | Wed Apr 08 07:49:25 EDT 2009 | davef
We don't view this as "board delamination." It looks more like "solder mask bubbling." It may be the picture. Please describe the issue or enclude additional pictures.
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