Electronics Forum: case (Page 8 of 246)

OEE excel template

Electronics Forum | Mon Sep 09 15:35:31 EDT 2019 | davef

The oven is the only thing that you need to manage, in your case

IC Solder Voiding

Electronics Forum | Fri Dec 20 10:08:24 EST 2019 | sangbui

I agree with you in this case. The voids on ground pad of IC

Lead Free BGA in Leaded Board

Electronics Forum | Mon Jul 06 12:01:24 EDT 2020 | mvargas

In case it is another component such as resistors or capacitors, does the same concept apply?

SMT Printing Stencil Storage

Electronics Forum | Tue May 03 20:40:28 EDT 2022 | dontfeedphils

In your opinion, and for your use case that may be true. I happen to disagree.

bubbles in solder pot

Electronics Forum | Wed Mar 15 15:24:52 EDT 2023 | joeljacobo

In this case nitrogen is not used but thanks for your contribution!

Juki Service Engineer Password for FX3 and KE3020

Electronics Forum | Tue May 09 01:53:01 EDT 2023 | frankchan

Hey, tried Capital"JUKI" and lower case"juki"

MPM Momentum

Electronics Forum | Tue Jul 18 09:52:21 EDT 2023 | dimamalin

The goal is clear, the question is in which case the use of "stepped down" is preferable to "continues"?

Clogged nozzle detected at NPM W machine

Electronics Forum | Fri Mar 22 16:25:01 EDT 2024 | carl_p

Faulty flow sensor in that case

Re: HASL alternatives

Electronics Forum | Thu Oct 26 10:32:14 EDT 2000 | CAL

We currently use a tool that we have developed and sell that can provide real time feed back on OSP coatings. With OSP it is a case by case basis on how many times you can reflow or apply heat before it becomes detrimental. Also, Depending on your pr

Re: Barcoding Component Reels

Electronics Forum | Thu Aug 17 09:08:16 EDT 2000 | Wolfgang Busko

In this case a marking of some kind that clearly distinguishes between those different parts is essential. Different stocknumber for example will do and can only be trusted if measurements like in this case do not give 100% clearness. If you have the


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