Electronics Forum: ceramice pcb bonding (Page 8 of 16)

Sir's can anyone help me..need advise

Electronics Forum | Tue Oct 04 20:18:17 EDT 2011 | denmark

Sir *We are using "HOT BAR SOLDERING" we are bonding "FFC" and "PCB" at 0.5mm pitch. Machine settings: Heating Temp. 310º, Colling Temp. 190º Delay Time 1sec We also using "BECKLITE" as Soldering Jig that can resist up to 400º. We are using 1 is to

SMT equipment--cheap/for starter

Electronics Forum | Fri Oct 14 12:03:32 EDT 2011 | fborja3

I want to start an assembly that may require use of SMT machines such as SMT assembly, bond wire, Xray and PCB fabricator machines. I apologize I am not to savvy with the technical names such as the above but I just want something not to costly or e

COB Process (Chip On Board)

Electronics Forum | Tue Nov 05 06:51:59 EST 2002 | V.RAMANAND KINI

Hi, This is a widely discussed subject and since you have asked a brief explanation, I assume, you are a business man or a top executive in the company venturing in to COB. I waited to see if someone replies to you. May be it is a very old subject

How much is the exposure tolerance for PCB auto dry film?

Electronics Forum | Fri Sep 28 02:48:46 EDT 2018 | teresat2

Principle A layer of photosensitive material (photosensitive oil or dry film) is applied to the copper foil on the board surface, and PCB manufacturer should be use the position is exposed by black film, This applies to most PCB factories, especially

glue measurement

Electronics Forum | Fri Oct 05 16:05:58 EDT 2001 | seand

Hello everyone, Your chief variable here is going to be your epoxy. Different materials react accordingly to various inspection methods but, DEPENDING on your print parameters and material, you may be able to utilize an inline inspection machine.

About the PCB gold finger contamination.

Electronics Forum | Thu Sep 19 21:23:42 EDT 2002 | davef

I'm not saying that an eraser will necessarily work. What I'm saying is that some erasers may cause more trouble than the eliminate. Look here http://aic.stanford.edu/jaic/articles/jaic28-02-003_2.html We prefer a brand called Ruby Red. The "ole

SAC305 preforms not wetting to ENIG pad in fluxless process

Electronics Forum | Tue Apr 13 11:41:18 EDT 2021 | jeremy_leaf

I have a SAC305 preform with which I am attempting to bond a gold coated component to an ENIG coated PCB pad. I've specified 2 microinches of gold for the ENIG. It worked previously but now with a new batch of boards, I am having an issue where the p

Voiding in uBGA's w/blind uvia's in pads

Electronics Forum | Thu Nov 22 12:56:12 EST 2001 | tony_sauve

Thanks for the comments & suggestions. Here's some info garnered from a telecon w/the PCB Fab house: -the blind via's extend from layer 2-17...this was a revelation. The info from our customer was that the via's only extended down 2 layers. Did I men

PCB pad contamination

Electronics Forum | Tue Aug 21 05:05:52 EDT 2007 | vangogh

Hi All, I would like to get some inputs regarding this.... I have bare PCB which were stored with kapton tape attached on the Au plated pads. These were stored for close to a year. Upon removal of kapton tape, we noticed discolorations on the edges o

Die attach with solder paste

Electronics Forum | Tue Aug 27 03:45:36 EDT 2002 | seje

Hi there. We are considering to attach die chip with solder paste to the pcb at the SMD line (we are used to attach it with silver epoxy at the die bonding line before). This is a whole new method to me, so I'd like to have some opinions here. Where


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